NXP Semiconductors - MPC8555ECPXAJD

MPC8555ECPXAJD by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8555ECPXAJD
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
Datasheet MPC8555ECPXAJD Datasheet
In Stock2,453
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.75 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 783
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 64
Technology: CMOS
JESD-30 Code: S-PBGA-B783
Maximum Clock Frequency: 166 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Speed: 533 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.26 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
JESD-609 Code: e0
Qualification: Not Qualified
Length: 29 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
2,453 $217.140 $532,644.420

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