NXP Semiconductors - MPC8572ECVTAVNE

MPC8572ECVTAVNE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8572ECVTAVNE
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE; Bit Size: 32;
Datasheet MPC8572ECVTAVNE Datasheet
In Stock2,592
NAME DESCRIPTION
Minimum Supply Voltage: 1.045 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Integrated Cache: YES
Maximum Seated Height: 3.38 mm
Surface Mount: YES
No. of Terminals: 1023
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B1023
Maximum Clock Frequency: 133 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HBGA
Width: 33 mm
Speed: 1500 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.155 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
Length: 33 mm
Terminal Pitch: 1 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
2,592 $385.460 $999,112.320

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