PCD3332-2PN by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	PCD3332-2PN
Description	TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet	PCD3332-2PN Datasheet
In Stock	4,085

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Telecom IC Type:	TELEPHONE MULTIFUNCTION CIRCUIT
Maximum Seated Height:	5.1 mm
Surface Mount:	NO
Maximum Supply Current:	1.8 mA
Minimum Operating Temperature:	-25 Cel
Make-break Ratio:	2:1
No. of Functions:	1
No. of Terminals:	28
Qualification:	Not Qualified
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Length:	35.5 mm
JESD-30 Code:	R-PDIP-T28
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Additional Features:	SELECTABLE MAKE/BREAK RATIO 3:2
Maximum Operating Temperature:	70 Cel
Package Code:	DIP
Width:	15.24 mm
Terminal Pitch:	2.54 mm
Temperature Grade:	OTHER

Pricing (USD)

Qty.	Unit Price	Ext. Price
4,085	-	-

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