NXP Semiconductors - PSMN009-100B,118

PSMN009-100B,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PSMN009-100B,118
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 230 W; JESD-609 Code: e3; Avalanche Energy Rating (EAS): 120 mJ;
Datasheet PSMN009-100B,118 Datasheet
In Stock2,660
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 75 A
Maximum Pulsed Drain Current (IDM): 400 A
Sub-Category: FET General Purpose Power
Surface Mount: YES
Terminal Finish: TIN
No. of Terminals: 2
Maximum Power Dissipation (Abs): 230 W
Terminal Position: SINGLE
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PSSO-G2
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 175 Cel
Case Connection: DRAIN
Maximum Drain-Source On Resistance: .0088 ohm
Moisture Sensitivity Level (MSL): 1
Avalanche Energy Rating (EAS): 120 mJ
Polarity or Channel Type: N-CHANNEL
JESD-609 Code: e3
Minimum DS Breakdown Voltage: 100 V
Qualification: Not Qualified
Maximum Drain Current (Abs) (ID): 75 A
Peak Reflow Temperature (C): 245
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Pricing (USD)

Qty. Unit Price Ext. Price
2,660 $1.200 $3,192.000

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