TDA8026ET/C2,557 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TDA8026ET/C2,557
Description	MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: FBGA; Package Shape: SQUARE;
Datasheet	TDA8026ET/C2,557 Datasheet
In Stock	3,730

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Peripheral IC Type:	MICROPROCESSOR CIRCUIT
Nominal Supply Voltage:	3.3 V
Sub-Category:	Other Microprocessor ICs
Surface Mount:	YES
Maximum Supply Current:	260 mA
Minimum Operating Temperature:	-25 Cel
No. of Terminals:	64
Qualification:	Not Qualified
Package Equivalence Code:	BGA64,8X8,32
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
JESD-30 Code:	S-PBGA-B64
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	FBGA
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Power Supplies (V):	3.3
Moisture Sensitivity Level (MSL):	2

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,730	-	-

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