TEA1069H by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TEA1069H
Description	TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
Datasheet	TEA1069H Datasheet
In Stock	3,272

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.7 V
Maximum Seated Height:	2.1 mm
Sub-Category:	Telephone Circuits
Surface Mount:	YES
Maximum Supply Current:	.0018 mA
No. of Terminals:	44
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
Technology:	BIPOLAR
JESD-30 Code:	S-PQFP-G44
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	75 Cel
Package Code:	QFP
Width:	10 mm
Moisture Sensitivity Level (MSL):	1
Telecom IC Type:	TELEPHONE MULTIFUNCTION CIRCUIT
Minimum Operating Temperature:	-25 Cel
Make-break Ratio:	2:1
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	QFP44,.5SQ,32
Length:	10 mm
Additional Features:	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL EXTENDED
Power Supplies (V):	3

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,272	-	-

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