Onsemi - FDT4N50NZU

FDT4N50NZU by Onsemi

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Manufacturer Onsemi
Manufacturer's Part Number FDT4N50NZU
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 59 W; Maximum Pulsed Drain Current (IDM): 12 A; Transistor Element Material: SILICON;
Datasheet FDT4N50NZU Datasheet
In Stock331
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 3 A
Maximum Pulsed Drain Current (IDM): 12 A
Surface Mount: YES
No. of Terminals: 4
Maximum Power Dissipation (Abs): 59 W
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G4
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 150 Cel
Case Connection: DRAIN
Maximum Drain-Source On Resistance: 3 ohm
Moisture Sensitivity Level (MSL): 1
Avalanche Energy Rating (EAS): 124 mJ
Maximum Feedback Capacitance (Crss): 3 pF
JEDEC-95 Code: TO-261AA
Polarity or Channel Type: N-CHANNEL
Minimum Operating Temperature: -55 Cel
Minimum DS Breakdown Voltage: 500 V
Maximum Drain Current (Abs) (ID): 3 A
Peak Reflow Temperature (C): 260
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Pricing (USD)

Qty. Unit Price Ext. Price
331 $0.542 $179.402

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