Renesas Electronics - 72T6360L7.5BBG

72T6360L7.5BBG by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 72T6360L7.5BBG
Description MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet 72T6360L7.5BBG Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.5 V
Maximum Seated Height: 1.97 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 324
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B324
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 2.625 V
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Length: 19 mm
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
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