Image shown is a representation only.
| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K4V1G323PC-XGC6T |
| Description | DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 152; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: SQUARE; |
| Datasheet | K4V1G323PC-XGC6T Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0006 Amp |
| Organization: | 32MX32 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 180 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 152 |
| Maximum Clock Frequency (fCLK): | 166 MHz |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B152 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 1073741824 bit |
| Sequential Burst Length: | 2,4,8,16 |
| Memory IC Type: | DDR1 DRAM |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 32 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA152,21X21,25 |
| Refresh Cycles: | 8192 |
| Interleaved Burst Length: | 2,4,8,16 |
| Maximum Access Time: | 5.5 ns |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8 |
