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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K8P3315UQB-EC4B0 |
| Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Memory Width: 16; |
| Datasheet | K8P3315UQB-EC4B0 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00003 Amp |
| Organization: | 2MX16 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 55 mA |
| Command User Interface: | YES |
| No. of Terminals: | 64 |
| No. of Words: | 2097152 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B64 |
| No. of Sectors/Size: | 16,62 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Boot Block: | BOTTOM/TOP |
| Memory Density: | 33554432 bit |
| Sector Size (Words): | 4K,32K |
| Toggle Bit: | YES |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 16 |
| Page Size (words): | 8 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA64,8X8,40 |
| Common Flash Interface: | YES |
| Maximum Access Time: | 60 ns |
| No. of Words Code: | 2M |
| Ready or Busy: | YES |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Data Polling: | YES |
| Power Supplies (V): | 3/3.3 |
