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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | KBE00F005A-D4110 |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: LFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B137; |
| Datasheet | KBE00F005A-D4110 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .001 Amp |
| Organization: | 8MX32 |
| Maximum Seated Height: | 1.4 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 20 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 137 |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B137 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 10.5 mm |
| Moisture Sensitivity Level (MSL): | 2 |
| Memory Density: | 268435456 bit |
| Mixed Memory Type: | FLASH+SDRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA137,10X15,32 |
| Length: | 13 mm |
| Maximum Access Time: | 30 ns |
| No. of Words Code: | 8M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | NAND FLASH IS ORGANIZED AS 64M X 8; NAND FLASH OPERATES AT 2.5V TO 2.9V SUPPLY |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 1.95 V |
| Power Supplies (V): | 2.7 |
