Samsung - S3C2400XX-YE

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S3C2400XX-YE by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3C2400XX-YE
Description MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: FBGA; Package Shape: SQUARE;
Datasheet S3C2400XX-YE Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 133 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Minimum Operating Temperature: 0 Cel
No. of Terminals: 208
Qualification: Not Qualified
Package Equivalence Code: BGA208,16X16,25
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B208
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Terminal Pitch: .635 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 1.8,3.3
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