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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | M65KG512AA8W9 |
| Description | DDR1 DRAM; Temperature Grade: OTHER; Package Code: DIE; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Organization: 32MX16; |
| Datasheet | M65KG512AA8W9 Datasheet |
| In Stock | 1,894 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Standby Current: | .00001 Amp |
| Organization: | 32MX16 |
| Output Characteristics: | 3-STATE |
| Access Mode: | FOUR BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 140 mA |
| Maximum Clock Frequency (fCLK): | 133 MHz |
| No. of Words: | 33554432 words |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| JESD-30 Code: | R-XUUC-N |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | DIE |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 536870912 bit |
| Self Refresh: | YES |
| Sequential Burst Length: | 2,4,8,16 |
| Memory IC Type: | DDR1 DRAM |
| Minimum Operating Temperature: | -30 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | WAFER |
| Refresh Cycles: | 8192 |
| Interleaved Burst Length: | 2,4,8,16 |
| Maximum Access Time: | 6 ns |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | AUTO/SELF REFRESH |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 1.9 V |
| Power Supplies (V): | 1.8 |
