NAND256R3M5AZB5F by STMicroelectronics | Memory ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	NAND256R3M5AZB5F
Description	MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 149; Package Code: FBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SDRAM;
Datasheet	NAND256R3M5AZB5F Datasheet
In Stock	3,001

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Mixed Memory Type:	FLASH+SDRAM
Sub-Category:	Other Memory ICs
Surface Mount:	YES
Memory IC Type:	MEMORY CIRCUIT
Minimum Operating Temperature:	-30 Cel
No. of Terminals:	149
Qualification:	Not Qualified
Package Equivalence Code:	BGA149,12X16,32
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
JESD-30 Code:	R-PBGA-B149
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Nominal Supply Voltage / Vsup (V):	1.8
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Power Supplies (V):	1.8

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,001	-	-

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