Texas Instruments - TMS428160AP50DGE

  1. Home
  2. Texas Instruments - TMS428160AP50DGE
TMS428160AP50DGE by Texas Instruments

Image shown is a representation only.

Manufacturer Texas Instruments
Manufacturer's Part Number TMS428160AP50DGE
Description DRAMs;
Datasheet TMS428160AP50DGE Datasheet
In Stock996
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
996 - -

Popular Products

Category Top Products

AS4C64M16D3LB-12BIN by Alliance Memory

AS4C64M16D3LB-12BIN

Alliance Memory

Alliance Memory's AS4C64M16D3LB-12BIN is a 64MX16 DDR3L DRAM with 1.35V supply, operating from -40 to 95 °C. It features synchronous mode, self-refresh capability, and multi-bank page burst access. Ideal for industrial applications requiring high memory density and thin profile grid array packaging.
MT41K256M16TW-107AAT:P by Micron Technology

MT41K256M16TW-107AAT:P

Micron Technology

Micron Technology's MT41K256M16TW-107AAT:P is a DDR3L DRAM with 256MX16 organization, operating at 934.57 MHz. It features a thin profile grid array package suitable for industrial applications requiring high memory density and common I/O type. With self-refresh capability and AEC-Q100 screening level, it offers reliable performance in harsh environments.
MT46H32M16LFBF-6IT:C by Micron Technology

MT46H32M16LFBF-6IT:C

Micron Technology

Micron Technology's MT46H32M16LFBF-6IT:C is a 32MX16 DDR1 DRAM with 536870912 bit memory density. It operates at 166 MHz clock frequency, suitable for industrial applications requiring fast access time of 5 ns. The package style is grid array with very thin profile and fine pitch, making it ideal for space-constrained designs.
MT47H128M16RT-25EAAT:C by Micron Technology

MT47H128M16RT-25EAAT:C

Micron Technology

Micron Technology's MT47H128M16RT-25EAAT:C is a DDR2 DRAM with 128MX16 organization, operating at 400 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT46H32M16LFBF-6IT:CTR by Micron Technology

MT46H32M16LFBF-6IT:CTR

Micron Technology

Micron Technology's MT46H32M16LFBF-6IT:CTR is a DDR1 DRAM with 32MX16 organization, 536870912 bit memory density, and operates at 1.8V. It features synchronous operation, self-refresh capability, and industrial temperature grade. Ideal for applications requiring fast access times and high memory capacity in compact devices.
NT5CC256M16EP-EKT by Nanya Technology

NT5CC256M16EP-EKT

Nanya Technology

NT5CC256M16EP-EKT by Nanya Technology is a DDR3L DRAM with 256MX16 organization and 4294967296 bit memory density. It operates at a voltage of 1.35V, has a temperature range of -40 to 95 °C, and is suitable for industrial applications.
IS43TR16256BL-125KBL-TR by Integrated Silicon Solution

IS43TR16256BL-125KBL-TR

Integrated Silicon Solution

IS43TR16256BL-125KBL-TR by Integrated Silicon Solution is a 256MX16 DDR3L DRAM with synchronous operation and self-refresh capability. It has a package style of GRID ARRAY, THIN PROFILE, FINE PITCH and is suitable for applications requiring high memory density and low power consumption.
AS4C512M16D3LB-12BCN by Alliance Memory

AS4C512M16D3LB-12BCN

Alliance Memory

Alliance Memory's AS4C512M16D3LB-12BCN is a 512MX16 DDR3L DRAM with 800 MHz clock frequency, 1.35V supply voltage, and 95°C operating temperature. Ideal for applications requiring high-speed synchronous memory with low power consumption and common I/O type.
K4S641632K-UC60 by Samsung

K4S641632K-UC60

Samsung

Samsung's K4S641632K-UC60 is a 4MX16 DRAM with 3.3V supply, operating at 166MHz. It features synchronous operation, self-refresh capability, and a small outline package shape. Ideal for applications requiring high-speed memory access in commercial temperature environments.
MT48LC16M16A2P-7E:GTR by Micron Technology

MT48LC16M16A2P-7E:GTR

Micron Technology

MT48LC16M16A2P-7E:GTR by Micron Technology is a 16MX16 SDRAM with 16777216 words, 268435456 bit memory density, and 5.4 ns max access time. Ideal for commercial applications requiring synchronous DRAM technology in a small outline package with dual terminal position.
MT40A256M16GE-083EAUT:B by Micron Technology

MT40A256M16GE-083EAUT:B

Micron Technology

Micron Technology's MT40A256M16GE-083EAUT:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for automotive applications due to AEC-Q100 screening level and thin profile grid array package style.
MT41J64M16JT-15E:G by Micron Technology

MT41J64M16JT-15E:G

Micron Technology

MT41J64M16JT-15E:G by Micron Technology is a DDR3 DRAM with 64MX16 organization, operating at 667 MHz. It features a 1.5V supply voltage and offers 67108864 words of memory. Ideal for applications requiring high-speed synchronous operation and common I/O type, such as servers, workstations, and networking equipment.
M393A2K43CB2-CVF by Samsung

M393A2K43CB2-CVF

Samsung

Samsung's M393A2K43CB2-CVF DDR4 DRAM module features 16GX8 organization, 1.2V supply voltage, and 137.4Gb memory density. Ideal for high-performance computing applications requiring fast data access with dual bank page burst capability in a compact MICROELECTRONIC ASSEMBLY package.
K4H560838H-UCB3 by Samsung

K4H560838H-UCB3

Samsung

Samsung's K4H560838H-UCB3 DDR1 DRAM features 32MX8 organization, operates at 166 MHz clock frequency, and has a memory density of 268MB. Ideal for commercial applications requiring high-speed data processing with a max operating temperature of 70°C.
MT48LC16M16A2BG-75IT:DTR by Micron Technology

MT48LC16M16A2BG-75IT:DTR

Micron Technology

Micron Technology's MT48LC16M16A2BG-75IT:DTR is a 16MX16 Synchronous DRAM with 268Mbit memory density. It operates at 3.3V, has a max access time of 5.4ns, and supports four bank page burst access mode. Ideal for industrial applications requiring high-speed memory with low power consumption.
EDB4432BBBJ-1D-F-D by Micron Technology

EDB4432BBBJ-1D-F-D

Micron Technology

Micron Technology's EDB4432BBBJ-1D-F-D is a 128MX32 LPDDR2 DRAM with 134 terminals in a very thin profile grid array package. Operating at 1.2V, it offers synchronous access mode and self-refresh capability for low power consumption. Ideal for applications requiring high memory density and fast data processing in compact devices.
AS4C64M16D3LB-12BINTR by Alliance Memory

AS4C64M16D3LB-12BINTR

Alliance Memory

Alliance Memory's AS4C64M16D3LB-12BINTR is a DDR3L DRAM with 64MX16 organization and 1.35V nominal voltage. It operates in synchronous mode, has self-refresh capability, and is suitable for industrial applications requiring high memory density.
MT40A512M16JY-083EAAT:BTR by Micron Technology

MT40A512M16JY-083EAAT:BTR

Micron Technology

MT40A512M16JY-083EAAT:BTR by Micron Technology is a DDR4 DRAM with 512MX16 organization, operating at a max clock frequency of 1200.4 MHz. It is commonly used in automotive applications due to its AEC-Q100 screening level and wide temperature range (-40°C to 105°C).
IS42S32400F-7TL by Integrated Silicon Solution

IS42S32400F-7TL

Integrated Silicon Solution

IS42S32400F-7TL by Integrated Silicon Solution is a 4MX32 DRAM with 3.3V supply, operating at 143MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in commercial temperature environments.
NT6DM32M16BD-T1I by Nanya Technology

NT6DM32M16BD-T1I

Nanya Technology

NT6DM32M16BD-T1I by Nanya Technology is a DDR1 DRAM with 32MX16 organization, 536870912 bit memory density, and operates at 1.8V. Suitable for industrial applications, it features synchronous operation, self-refresh capability, and a very thin profile grid array package style.