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Manufacturer | Toshiba |
---|---|
Manufacturer's Part Number | TC59LM913AMG-50 |
Description | DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 16.5 mm; |
Datasheet | TC59LM913AMG-50 Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Organization: | 32MX16 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.2 mm |
Access Mode: | MULTI BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 2.35 V |
Sub-Category: | DRAMs |
Surface Mount: | YES |
No. of Terminals: | 64 |
Maximum Clock Frequency (fCLK): | 200 MHz |
No. of Words: | 33554432 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE |
Technology: | MOS |
JESD-30 Code: | R-PBGA-B64 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TBGA |
Width: | 12.7 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 536870912 bit |
Self Refresh: | YES |
Sequential Burst Length: | 2,4 |
Memory IC Type: | DDR1 DRAM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 16 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA60,6X15,40 |
Interleaved Burst Length: | 2,4 |
Length: | 16.5 mm |
Maximum Access Time: | .65 ns |
No. of Words Code: | 32M |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Additional Features: | AUTO/SELF REFRESH |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1 mm |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 2.65 V |
Power Supplies (V): | 2.5 |