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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XA7Z010-1CLG225I |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Width: 13 mm; |
| Datasheet | XA7Z010-1CLG225I Datasheet |
| In Stock | 1,571 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Ultraviolet Erasable: | N |
| Maximum Seated Height: | 1.5 mm |
| Sub-Category: | Other uPs/uCs/Peripheral ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| No. of Terminals: | 225 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA225,15X15,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Screening Level: | AEC-Q100 |
| Length: | 13 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B225 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | LFBGA |
| Width: | 13 mm |
| Terminal Pitch: | .8 mm |
| Power Supplies (V): | 1,1.8 |
| Moisture Sensitivity Level (MSL): | 3 |









