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Manufacturer | Xilinx |
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Manufacturer's Part Number | XA7Z010-1CLG225I |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Width: 13 mm; |
Datasheet | XA7Z010-1CLG225I Datasheet |
In Stock | 405 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Ultraviolet Erasable: | N |
Maximum Seated Height: | 1.5 mm |
Sub-Category: | Other uPs/uCs/Peripheral ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 225 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA225,15X15,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Screening Level: | AEC-Q100 |
Length: | 13 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B225 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | LFBGA |
Width: | 13 mm |
Terminal Pitch: | .8 mm |
Power Supplies (V): | 1,1.8 |
Moisture Sensitivity Level (MSL): | 3 |