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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC17128L-DD8M |
| Description | CONFIGURATION MEMORY; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 131072 bit; |
| Datasheet | XC17128L-DD8M Datasheet |
| In Stock | 388 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 128KX1 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 5 mA |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 10 MHz |
| No. of Words: | 131072 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-XDIP-T8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Input/Output Type: | COMMON |
| Memory Density: | 131072 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| Minimum Operating Temperature: | -55 Cel |
| Memory Width: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP8,.3 |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
| Power Supplies (V): | 3.3 |
