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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC7V855T-1FFG784I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245; |
Datasheet | XC7V855T-1FFG784I Datasheet |
In Stock | 371 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | Plastic/Epoxy |
Programmable IC Type: | FPGA |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Surface Mount: | Yes |
JESD-609 Code: | e1 |
Position Of Terminal: | Bottom |
No. of Terminals: | 784 |
Qualification: | No |
Finishing Of Terminal Used: | Tin/Silver/Copper |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B784 |
Form Of Terminal: | Ball |
Package Shape: | Square |
Package Code: | BGA |
Peak Reflow Temperature (C): | 245 °C (473 °F) |
Moisture Sensitivity Level (MSL): | 4 |