Xilinx - XC7Z030-L1SBG485I

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XC7Z030-L1SBG485I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z030-L1SBG485I
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 485; Package Code: FBGA; Package Shape: SQUARE; No. of Outputs: 280;
Datasheet XC7Z030-L1SBG485I Datasheet
In Stock433
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 9825 CLBS, 1300000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.27 ns
Maximum Seated Height: 2.44 mm
No. of Inputs: 280
Surface Mount: Yes
No. of Outputs: 280
Position Of Terminal: Bottom
No. of Terminals: 485
No. of Equivalent Gates: 1900000
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B485
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: FBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA SOC
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
No. of Logic Cells: 125000
No. of CLBs: 9825
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA484,22X22,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 19 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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