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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCV400-5BGG560I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; No. of Equivalent Gates: 468252; |
Datasheet | XCV400-5BGG560I Datasheet |
In Stock | 322 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.375 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 2400 CLBS, 468252 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 0.7 ns |
Maximum Seated Height: | 1.7 mm |
Surface Mount: | Yes |
Position Of Terminal: | Bottom |
No. of Terminals: | 560 |
No. of Equivalent Gates: | 468252 |
Package Style (Meter): | Grid Array, Low Profile |
JESD-30 Code: | S-PBGA-B560 |
Maximum Clock Frequency: | 294 MHz |
Package Shape: | Square |
Package Code: | LBGA |
Width: | 42.5 mm |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 2.625 V |
Nominal Supply Voltage (V): | 2.5 |
Technology Used: | CMOS |
No. of CLBs: | 2400 |
JESD-609 Code: | e1 |
Qualification: | No |
Finishing Of Terminal Used: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Length: | 42.5 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1.27 mm |
Peak Reflow Temperature (C): | 260 °C (500 °F) |