Xilinx - XCVM1402-2LSENSVF1369

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XCVM1402-2LSENSVF1369 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVM1402-2LSENSVF1369
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;
Datasheet XCVM1402-2LSENSVF1369 Datasheet
In Stock309
NAME DESCRIPTION
Minimum Supply Voltage: .676 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .7 V
Maximum Supply Voltage: .724 V
Maximum Seated Height: 4 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 1369
Package Equivalence Code: BGA1369,37X37,36
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 35 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B1369
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: HBGA
Width: 35 mm
Terminal Pitch: .92 mm
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