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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCVP2802-1LLIVSVA5601 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA5601,75X75,36; |
Datasheet | XCVP2802-1LLIVSVA5601 Datasheet |
In Stock | 377 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .676 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | .7 V |
Maximum Supply Voltage: | .724 V |
Maximum Seated Height: | 4.55 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 5601 |
Package Equivalence Code: | BGA5601,75X75,36 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Length: | 70 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B5601 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 110 Cel |
Package Code: | HBGA |
Width: | 70 mm |
Terminal Pitch: | .92 mm |