Xilinx - XCZU3EG-3SFVA625E

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XCZU3EG-3SFVA625E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU3EG-3SFVA625E
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCZU3EG-3SFVA625E Datasheet
In Stock234
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .9 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
No. of Terminals: 625
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B625
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Temperature Grade: OTHER
Moisture Sensitivity Level (MSL): 4
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