Xilinx - XCZU6CG-2LFFVB1156I

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XCZU6CG-2LFFVB1156I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU6CG-2LFFVB1156I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCZU6CG-2LFFVB1156I Datasheet
In Stock321
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .85 V
Maximum Seated Height: 3.42 mm
External Data Bus Width: 0
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 1156
Package Equivalence Code: BGA1156,34X34,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 35 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B1156
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Bus Compatibility: CAN, I2C, SPI, UART
Width: 35 mm
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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