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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCZU6EG-3FFVB1156I |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XCZU6EG-3FFVB1156I Datasheet |
| In Stock | 1,255 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | .9 V |
| Maximum Seated Height: | 3.42 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 1156 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 35 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B1156 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | BGA |
| Width: | 35 mm |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 4 |








