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Manufacturer | Xilinx |
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Manufacturer's Part Number | XQ7A50T-1CS325M |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | XQ7A50T-1CS325M Datasheet |
In Stock | 798 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 4075 CLBS |
Maximum Combinatorial Delay of a CLB: | 1.27 ns |
No. of Inputs: | 150 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 150 |
Position Of Terminal: | Bottom |
No. of Terminals: | 324 |
Package Style (Meter): | Grid Array, Fine Pitch |
JESD-30 Code: | S-PBGA-B324 |
Maximum Clock Frequency: | 1098 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 125 °C (257 °F) |
Package Code: | FBGA |
Width: | 15 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Military |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.05 V |
Nominal Supply Voltage (V): | 1 |
Technology Used: | HKMG |
No. of Logic Cells: | 52160 |
No. of CLBs: | 4075 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -55 °C (-67 °F) |
Qualification: | No |
Package Equivalence Code: | BGA324,18X18,32 |
Finishing Of Terminal Used: | Tin/Lead |
Length: | 15 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | .8 mm |
Power Supplies (V): | 1 V |