Image shown is a representation only.
| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XQZU3EG-1SFRC784M |
| Description | PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 220; |
| Datasheet | XQZU3EG-1SFRC784M Datasheet |
| In Stock | 129 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .808 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | .85 V |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | 3.52 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 784 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B784 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | FBGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Peripheral IC Type: | PROGRAMMABLE SoC |
| Maximum Supply Voltage: | .892 V |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 Cel |
| Package Equivalence Code: | BGA784,28X28,32 |
| Length: | 23 mm |
| Peak Reflow Temperature (C): | 220 |
| Terminal Pitch: | .8 mm |
