Analog To Digital Converter, Flash Method Analog-to-Digital Converters 1,746

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7820LRZ-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

7.3 V

1

CMOS

8

15 mA

0.195 %

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

1.36 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

AD9467SCPZ-250-EP

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

72

HVQCCN

Square

1

Yes

2.5 V

250 MHz

1

16

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-XQCC-N72

3

0.035 in (0.9 mm)

0.394 in (10 mm)

e4

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD671JD-500

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0977 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

LTC1099AIN

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

400 kHz

1

8

0.1953 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Sample

Dual

5 µs

R-PDIP-T20

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

5962-8876403XB

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7821BCHIPS

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

20

DIE

1

Yes

2.5 V

1 MHz

1

BICMOS

8

0.3906 %

5 V

Binary, Offset Binary

-5 V

Uncased Chip

85 °C (185 °F)

-2.5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Track

Upper

660 ns

X-XUUC-N20

No

AD7821KRZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1 MHz

1

CMOS

8

0.39 %

5 V

Binary, Offset Binary

5,GND/-5 V

-5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2.5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

660 ns

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

5962-9312601MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

MIL-STD-883

12

0.061 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

AD9642BCPZRL7-210

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

1.75 V

210 MHz

1

CMOS

14

0.0122 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.75 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

4.76 ns

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD7884BPZ-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

2

Yes

5 V

166 kHz

1

CMOS

16

0.0075 %

5 V

2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

5.3 µs

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e3

260 °C (500 °F)

0.653 in (16.5862 mm)

5962-9551901MLX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 MHz

1

BICMOS

MIL-STD-883

12

0.0977 %

5 V

Binary

-5 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

500 ns

R-CDIP-T24

No

AD1671JQ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.0813 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD678SD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

38535Q/M;38534H;883B

12

34 mA

0.0488 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9245BCPZRL7-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

65 MHz

1

CMOS

14

0.0339 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

AD871JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

5 MHz

1

BICMOS

12

0.0366 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

200 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9608BCPZ-105

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

105 MHz

1

10

0.0391 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

9.52 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9005ALM

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

46

DIP

Rectangular

Metal

1

No

3 V

10 MHz

1

Bipolar

12

55 mA

0.03 %

15 V

Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

AD16710713F

Analog Devices

Analog To Digital Converter, Flash Method

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1.25 MHz

1

12

0.07324 %

5 V

Binary

-5 V

Flatpack

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

800 ns

R-CDFP-F28

AD9613BCPZRL7-250

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

1.75 V

250 MHz

1

12

0.0195 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

4 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD7822BNZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.5 V

2 MHz

1

CMOS

8

0.293 %

3 V

Binary

3/5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

420 ns

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.03 in (26.16 mm)

AD9245BCPZRL7-40

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

40 MHz

1

CMOS

14

0.0208 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

AD7820LNZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

7.3 V

1

CMOS

8

15 mA

0.195 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

1.36 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.992 in (25.2 mm)

5962-8876402LA

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

MIL-STD-883

8

20 mA

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

R-GDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

AD7821TE

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.5 V

1 MHz

1

CMOS

8

0.39 %

5 V

Binary, Offset Binary

5,GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

660 ns

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD9028KE

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

325 MHz

1

Bipolar

8

475 mA

0.293 %

Offset Binary, 2's Complement Binary

-5.2 V

-5.2 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-6 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Quad

3.3 ns

S-CQCC-N68

0.103 in (2.62 mm)

0.953 in (24.195 mm)

No

e0

0.953 in (24.195 mm)

AD9060TE/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

Bipolar

38535Q/M;38534H;883B

10

500 mA

0.1953 %

5 V

Binary

5,-5.2 V

-5 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N68

0.103 in (2.62 mm)

0.953 in (24.195 mm)

No

e0

0.953 in (24.195 mm)

ADUCM300WBCPZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

2

Yes

8000 MHz

1

AEC-Q100

20

0.02 %

7 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

115 °C (239 °F)

Serial

-40 °C (-40 °F)

Quad

S-PQCC-N32

0.039 in (1 mm)

0.236 in (6 mm)

0.236 in (6 mm)

AD9054BST-200

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

2

Yes

1 V

200 MHz

1

BICMOS

8

0.7812 %

5 V

Binary

5 V

Flatpack, Low Profile

QFP44,.47SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G44

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD671KN-500

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

11 V

2.1 MHz

1

CMOS

12

56 mA

0.048 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-6.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

500 ns

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

5962-8876402LC

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9253BCPZRL7-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

48

HVQCCN

Square

4

Yes

2 V

125 MHz

1

CMOS

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

8 ns

S-XQCC-N48

3

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD671JN-500

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

11 V

2.1 MHz

1

CMOS

12

56 mA

0.096 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-6.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

500 ns

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD9626BCPZRL7-210

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

56

HVQCCN

Square

1

Yes

1.5 V

210 MHz

1

CMOS

12

0.0269 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

4.762 ns

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

AD9006KE

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

1 V

500 MHz

1

Bipolar

6

0.7812 %

5 V

Binary, 2's Complement Binary

5,-5.2 V

-5.2 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

2 ns

S-CQCC-N68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD9223ARSZ-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

3 MHz

1

CMOS

12

0.0305 %

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

0.402 in (10.2 mm)

AD7825BNZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

5.5 V

2 MHz

1

CMOS

8

0.293 %

3 V

Binary

3/5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

420 ns

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.25 in (31.75 mm)

AD1671KPZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

800 ns

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

0.453 in (11.5062 mm)

AD9003KM

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

40

DIP

Rectangular

Metal

1

No

15 V

1 MHz

1

12

90 mA

0.036 %

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

1 µs

R-MDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD9627ABCPZ-105

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

2 V

105 MHz

1

CMOS

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

9.5 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9060SZ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

Bipolar

38535Q/M;38534H;883B

10

500 mA

0.2441 %

5 V

Binary

5,-5.2 V

-5 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-G68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD9002TE/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.4688 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

8 ns

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD9238BST-65PCB

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

2

Yes

2 V

65 MHz

1

CMOS

12

0.0427 %

3 V

Offset Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.016 in (0.4 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

5962-9050802M3X

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

125 MHz

1

Bipolar

8

0.1953 %

Binary

-5.2 V

Chip Carrier

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

AD9221AR

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

1.5 MHz

1

CMOS

12

0.0305 %

5 V

Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

5962-89518012C

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

CMOS

8

25 mA

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

975 ns

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD9258BCPZ-80

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

80 MHz

1

CMOS

14

0.0067 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

12.5 ns

S-XQCC-N64

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

AD671SD-500/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.0977 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9040AJN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

0 mV

40 MHz

1

BICMOS

10

0.0977 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.