Analog To Digital Converter, Flash Method Analog-to-Digital Converters 1,746

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7884BP

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

2

Yes

5 V

166 kHz

1

CMOS

16

0.0075 %

5 V

2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

5.3 µs

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

0.653 in (16.5862 mm)

AD7820LN

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

7.3 V

1

CMOS

8

15 mA

0.195 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

1.36 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

AD1679JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

100 kHz

1

BICMOS

12

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8.5 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

AD7822BN

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.5 V

2 MHz

1

CMOS

8

0.293 %

3 V

Binary

3/5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

420 ns

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

AD9038SE/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

325 MHz

1

Bipolar

8

495 mA

0.39 %

Offset Binary, 2's Complement Binary

-5.2 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-6 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

3.3 ns

S-CQCC-N68

0.103 in (2.62 mm)

0.953 in (24.195 mm)

No

e0

0.953 in (24.195 mm)

AD7822BR-REEL7

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.5 V

2 MHz

1

CMOS

8

0.293 %

3 V

Binary

3/5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

420 ns

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.504 in (12.8 mm)

AD7824KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

5 V

100 kHz

1

CMOS

8

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2.4 µs

R-PDIP-T24

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e0

1.165 in (29.59 mm)

AD1779JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

100 kHz

1

BICMOS

14

32 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8.5 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.425 in (36.205 mm)

AD9627ABCPZRL7-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

125 MHz

1

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

100 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9226ARSZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

65 MHz

1

CMOS

12

0.0391 %

5 V

Binary, 2's Complement Binary

3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

0.402 in (10.2 mm)

5962-9050801MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

125 MHz

1

Bipolar

8

0.3906 %

Binary

-5.2 V

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

5962-8876403XC

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7885ABP-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

2

Yes

5 V

166 kHz

1

CMOS

16

0.0075 %

5 V

2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Sample

Quad

5.3 µs

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

0.653 in (16.5862 mm)

AD1671AP

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

800 ns

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

AD9048SQ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

0 mV

35 MHz

1

Bipolar

38535Q/M;38534H;883B

8

110 mA

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7884AP-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

2

Yes

5 V

166 kHz

1

CMOS

16

5 V

2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

5.3 µs

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

0.653 in (16.5862 mm)

AD9002BJ

Analog Devices

Analog To Digital Converter, Flash Method

Other

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

Bipolar

8

0.4688 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Quad

S-CQCC-J28

0.125 in (3.18 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD9236BCPZRL7-80

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

80 MHz

1

CMOS

12

0.0293 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

5962-8876403XA

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

MIL-STD-883

8

20 mA

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

AD9236BRU-80

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

80 MHz

1

CMOS

12

0.0293 %

3 V

Offset Binary, 2's Complement Binary

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0.382 in (9.7 mm)

AD9223ARZ-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

3 MHz

1

CMOS

12

0.0305 %

5 V

Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

AD9258BCPZ-105

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

105 MHz

1

CMOS

14

0.0079 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

9.5 ns

S-XQCC-N64

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

AD9265BCPZRL7-105

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

48

HVQCCN

Square

1

Yes

2 V

105 MHz

1

16

176 mA

0.00534 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

100 ns

S-XQCC-N48

3

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD779JDZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BIMOS

14

12 V

Binary, 2's Complement Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Sample

Dual

6.3 µs

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

1.41 in (35.815 mm)

AD9215BRURL7-80

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

80 MHz

1

CMOS

10

0.1172 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0.382 in (9.7 mm)

AD7885AAP

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

2

Yes

5 V

166 kHz

1

CMOS

16

5 V

2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Sample

Quad

5.3 µs

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

0.653 in (16.5862 mm)

AD671SD-750/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD679JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD679KNZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

6.3 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.473 in (37.425 mm)

5962-88650022B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

8

20 mA

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Quad

2.5 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

AD7820KPZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

1

Yes

7.3 V

1

CMOS

8

15 mA

0.39 %

5 V

Binary

5 V

Chip Carrier

LDCC20,.4SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Quad

1.36 µs

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

0.353 in (8.9662 mm)

5962-9171201HXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

16

15 V

Binary

±5,±15 V

-15 V

In-Line

DIP48,1.0

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T48

0.233 in (5.92 mm)

1 in (25.4 mm)

No

e0

2.475 in (62.865 mm)

AD7828LNZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

50 kHz

1

CMOS

8

0.1953 %

5 V

Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2.4 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

AD7820LP-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

1

Yes

7.3 V

1

CMOS

8

15 mA

0.195 %

5 V

Binary

5 V

Chip Carrier

LDCC20,.4SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

1.36 µs

S-PQCC-J20

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

0.353 in (8.9662 mm)

AD9057BRS-RL60

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

1

Yes

60 MHz

1

BICMOS

8

0.7812 %

5 V

Offset Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.283 in (7.2 mm)

AD679AJZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

-12 V

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Gold

Sample

Quad

6.3 µs

S-CQCC-J44

0.135 in (3.42 mm)

0.65 in (16.51 mm)

No

e4

0.65 in (16.51 mm)

AD9005KM

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

46

DIP

Rectangular

Metal

1

No

1.024 V

1

Bipolar

12

0.061 %

Offset Binary

5,-5.2,±15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin/Lead

Dual

R-MDIP-T46

No

e0

AD9238BSTRL-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

2

Yes

2 V

65 MHz

1

CMOS

12

0.0427 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Flatpack, Low Profile, Fine Pitch

QFP64,.35SQ,16

Analog to Digital Converters

0.016 in (0.4 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Sample

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

30 s

240 °C (464 °F)

0.276 in (7 mm)

5962-9551902MLA

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 MHz

1

BICMOS

12

0.061 %

5 V

Binary

-5 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

750 ns

R-CDIP-T24

1

No

AD9258BCPZ-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

125 MHz

1

CMOS

14

0.0085 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

8 ns

S-XQCC-N64

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

AD9648TCPZ125EPRL7

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

64

HVQCCN

Square

2

Yes

2 V

125 MHz

1

14

0.0159 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2 V

Serial, Parallel, Word

-55 °C (-67 °F)

Sample

Quad

100 ns

S-XQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9257BCPZ-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

8

Yes

2 V

65 MHz

1

CMOS

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

15.3 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD671KD-750

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0366 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

AD9269BCPZRL7-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2 V

65 MHz

1

16

0.0099 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

15.3 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9040AJR-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

0 mV

40 MHz

1

BICMOS

10

0.0977 %

5 V

Offset Binary

±5 V

-5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

AD9223ARS-REEL

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

3 MHz

1

CMOS

12

0.0305 %

5 V

Binary

5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.402 in (10.2 mm)

AD1678KD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

200 kHz

1

BICMOS

12

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

4.47 µs

R-CDIP-T28

0.175 in (4.45 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD7824KRZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

4

Yes

5 V

100 kHz

1

CMOS

8

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2.4 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.