Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
8 |
Yes |
5 V |
50 kHz |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
2.8 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
200 kHz |
1 |
BIMOS |
12 |
0.0244 % |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.4 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.445 in (36.7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.75 V |
60 MHz |
1 |
Bipolar |
38535Q/M;38534H;883B |
10 |
542 mA |
0.2441 % |
5 V |
Binary |
±5 V |
-5 V |
Flatpack |
QFP68,1.1SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
S-CQFP-G68 |
0.118 in (2.997 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
7.3 V |
1 |
CMOS |
8 |
15 mA |
0.195 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
1.36 µs |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e0 |
0.353 in (8.9662 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
2 MHz |
1 |
BICMOS |
12 |
0.061 % |
5 V |
Binary, Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
750 ns |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.2 in (30.48 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
166 kHz |
1 |
CMOS |
16 |
0.0075 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
5.3 µs |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e0 |
225 °C (437 °F) |
0.653 in (16.5862 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
100 mV |
125 MHz |
1 |
Bipolar |
MIL-STD-883 |
8 |
0.1953 % |
Binary |
-5.2 V |
-5.2 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
8 |
Yes |
5 V |
50 kHz |
1 |
BICMOS |
8 |
20 mA |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
2 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
1 |
8 |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3.75 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.504 in (12.8 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
No Lead |
68 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
500 mV |
325 MHz |
1 |
Bipolar |
8 |
475 mA |
0.39 % |
Offset Binary, 2's Complement Binary |
-5.2 V |
-5.2 V |
Chip Carrier |
LCC68,.95SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-6 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Quad |
3.3 ns |
S-CQCC-N68 |
0.103 in (2.62 mm) |
0.953 in (24.195 mm) |
No |
e0 |
0.953 in (24.195 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.705 in (17.9 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.256 in (6.5 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
420 ns |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.705 in (17.9 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
7.3 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.992 in (25.2 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
12 |
0.0293 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
200 kHz |
1 |
BIMOS |
12 |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-40 °C (-40 °F) |
Sample |
Dual |
4.4 µs |
R-CDIP-T28 |
0.165 in (4.191 mm) |
0.6 in (15.24 mm) |
No |
1.41 in (35.815 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
100 |
HQFP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
512 mV |
140 MHz |
1 |
BICMOS |
8 |
0.6836 % |
5 V |
Binary |
3.3/5 V |
Flatpack, Heat Sink/Slug |
QFP100,.7X.9 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-PQFP-G100 |
5 |
0.134 in (3.4 mm) |
0.551 in (14 mm) |
No |
e0 |
225 °C (437 °F) |
0.787 in (20 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1.1 MHz |
1 |
BICMOS |
12 |
35 mA |
0.0488 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
100 ns |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
75 MHz |
1 |
Bipolar |
10 |
0.1465 % |
5 V |
Binary |
-5.2 V |
Flatpack |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
S-CQFP-G68 |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
16 |
0.01248 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
68 |
HQFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.75 V |
75 MHz |
1 |
Bipolar |
10 |
0.1953 % |
5 V |
Offset Binary, 2's Complement Binary |
5,-5.2 V |
-5.2 V |
Flatpack, Heat Sink/Slug |
QFP68,1.1SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-1.75 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Quad |
13.3 ns |
S-CQFP-G68 |
0.143 in (3.625 mm) |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
4 |
Yes |
2.8 V |
125 MHz |
1 |
16 |
0.0153 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.8 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
25 ns |
S-XQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
20 mA |
0.3906 % |
5 V |
Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
2.5 µs |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.382 in (9.7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
1.5 MHz |
1 |
CMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
80 |
HTQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
768 mV |
210 MHz |
1 |
BICMOS |
10 |
0.293 % |
3.3 V |
Binary, 2's Complement Binary |
3.3,5 V |
Flatpack, Heat Sink/Slug, Thin Profile |
TQFP80,.63SQ,25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-768 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.551 in (14 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.551 in (14 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
0 mV |
35 MHz |
1 |
Bipolar |
38535Q/M;38534H;883B |
8 |
110 mA |
0.293 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
500 mV |
38 MHz |
1 |
Bipolar |
8 |
110 mA |
0.293 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-7 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
29 ns |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
5 V |
50 kHz |
1 |
BICMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
166 kHz |
1 |
CMOS |
16 |
0.0075 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
5.3 µs |
S-PQCC-J44 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e0 |
0.653 in (16.5862 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1.25 MHz |
1 |
BICMOS |
MIL-STD-883 |
12 |
68 mA |
0.061 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
800 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1 V |
60 MHz |
1 |
BICMOS |
8 |
48 mA |
0.7812 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G20 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.283 in (7.2 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
13 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
12 |
150 mA |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
100 ns |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
5 V |
50 kHz |
1 |
BICMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
100 mV |
38 MHz |
1 |
Bipolar |
8 |
0.293 % |
5 V |
Binary, Offset 2's Complement |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.1 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
29 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Metal |
1 |
No |
1.024 V |
20 MHz |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
760 mA |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-MDIP-T40 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.75 V |
75 MHz |
1 |
10 |
5 V |
Offset Binary, 2's Complement Binary |
-5.2 V |
Flatpack |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-1.75 V |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
S-CQFP-G68 |
0.143 in (3.622 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
5 V |
50 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
1 |
8 |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3.75 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
255 °C (491 °F) |
0.504 in (12.8 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
31 MHz |
1 |
Bipolar |
12 |
248 mA |
0.0732 % |
5 V |
Offset Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.284 in (7.21 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.4 in (35.56 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
1.75 V |
210 MHz |
1 |
CMOS |
12 |
0.0098 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.75 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
4.7 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
12 V |
Binary, 2's Complement Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
6.3 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
100 kHz |
1 |
BICMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.