Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
1 |
Yes |
2.5 V |
250 MHz |
1 |
BICMOS |
16 |
0.0145 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Quad |
4 ns |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
48 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
500 kHz |
1 |
Hybrid |
16 |
0.0015 % |
15 V |
Complementary 2's Complement, Complementary Offset Binary |
±5,±15 V |
-15 V |
In-Line |
DIP48,1.0 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T48 |
0.233 in (5.92 mm) |
1 in (25.4 mm) |
No |
e0 |
2.475 in (62.865 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
60 MHz |
1 |
BICMOS |
8 |
0.7812 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
68 |
HQCCN |
Square |
1 |
Yes |
60 MHz |
1 |
MIL-STD-883 |
10 |
0.2441 % |
5 V |
Binary |
-5 V |
Chip Carrier, Heat Sink/Slug |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
16.6 ns |
S-XQCC-N68 |
0.113 in (2.87 mm) |
0.95 in (24.13 mm) |
0.95 in (24.13 mm) |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
3 MHz |
1 |
CMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
0.705 in (17.9 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary, Offset Binary |
5,GND/-5 V |
-5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
660 ns |
S-PQCC-J20 |
1 |
0.173 in (4.39 mm) |
0.352 in (8.93 mm) |
No |
e0 |
0.352 in (8.93 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
5 V |
50 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
2.4 µs |
S-PQCC-J28 |
3 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e3 |
260 °C (500 °F) |
0.453 in (11.5062 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0079 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
9.5 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
10 V |
1 |
BICMOS |
38535Q/M;38534H;883B |
12 |
34 mA |
0.0488 % |
12 V |
Binary |
5,±12 V |
-12 V |
Chip Carrier |
LCC44,.65SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Quad |
4.4 µs |
S-CQCC-J44 |
0.135 in (3.43 mm) |
0.645 in (16.385 mm) |
No |
e0 |
0.645 in (16.385 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
68 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.75 V |
60 MHz |
1 |
Bipolar |
MIL-STD-883 |
10 |
0.2197 % |
5 V |
Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LCC68,.95SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-1.75 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Quad |
S-CQCC-N68 |
0.118 in (2.997 mm) |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
75 MHz |
1 |
Bipolar |
10 |
0.1953 % |
5 V |
Binary |
-5.2 V |
Flatpack |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
S-CQFP-G68 |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
20.48 MHz |
1 |
CMOS |
12 |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
49 ns |
R-CDIP-T40 |
0.225 in (5.715 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.095 in (53.21 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1 V |
60 MHz |
1 |
BICMOS |
8 |
0.9766 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1.25 MHz |
1 |
BICMOS |
38535Q/M;38534H;883B |
12 |
68 mA |
0.061 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
800 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
10 |
0.1172 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.382 in (9.7 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.8 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.2 V |
500 MHz |
1 |
CMOS |
8 |
130 mA |
0.1172 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.2 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
200 MHz |
1 |
BICMOS |
8 |
0.7812 % |
5 V |
Binary |
5 V |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G44 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4 V |
65 MHz |
1 |
CMOS |
14 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
128 kHz |
1 |
BIMOS |
14 |
0.0122 % |
12 V |
Binary, 2's Complement Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
6.3 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
1.445 in (36.703 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0067 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
7 V |
1 |
10 |
0.098 % |
5 V |
Offset Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-7 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
25 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
20 |
DIE |
1 |
Yes |
2.5 V |
1 MHz |
1 |
BICMOS |
8 |
0.3906 % |
5 V |
Binary, Offset Binary |
-5 V |
Uncased Chip |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Track |
Upper |
660 ns |
X-XUUC-N20 |
No |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
3 MHz |
1 |
CMOS |
14 |
0.015 % |
5 V |
Binary |
5 V |
Flatpack |
QFP44,.52SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
200 kHz |
1 |
BIMOS |
12 |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
4.4 µs |
R-CDIP-T28 |
0.165 in (4.191 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
200 kHz |
1 |
BICMOS |
12 |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
4.47 µs |
R-CDIP-T28 |
0.175 in (4.45 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.382 in (9.7 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
0.3906 % |
5 V |
Binary, Offset Binary |
5,GND/-5 V |
-5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
660 ns |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
68 |
HQCCN |
Square |
1 |
Yes |
75 MHz |
1 |
MIL-STD-883 |
10 |
0.2441 % |
5 V |
Binary |
-5.2 V |
Chip Carrier, Heat Sink/Slug |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
13.3 ns |
S-XQCC-N68 |
0.113 in (2.87 mm) |
0.95 in (24.13 mm) |
0.95 in (24.13 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.027 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
115 °C (239 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
25 ns |
S-PQFP-G64 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
0 mV |
150 MHz |
1 |
Bipolar |
8 |
0.4688 % |
Binary |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
9.5 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0171 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
100 ns |
S-PQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
100 mV |
125 MHz |
1 |
Bipolar |
MIL-STD-883 |
8 |
0.3906 % |
Binary |
-5.2 V |
-5.2 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
No |
e0 |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
100 MHz |
1 |
CMOS |
8 |
0.2539 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Pin/Peg |
37 |
Rectangular |
1 |
No |
1 V |
10 MHz |
1 |
Hybrid |
14 |
0.009 % |
5 V |
Offset Binary |
5,-5.2,±15 V |
-5.2 V |
Microelectronic Assembly |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-XQMA-P37 |
No |
e0 |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
10 |
0.1172 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
1.75 V |
250 MHz |
1 |
CMOS |
12 |
0.0146 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.75 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
4 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1.25 MHz |
1 |
BICMOS |
12 |
68 mA |
0.0732 % |
5 V |
Binary, Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
800 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
7.3 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-300 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
25 MHz |
1 |
Bipolar |
12 |
0.0488 % |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1.024 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
93.1 ns |
R-CDIP-T40 |
0.225 in (5.715 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.095 in (53.21 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
1.5 V |
170 MHz |
1 |
CMOS |
12 |
0.022 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N72 |
0.039 in (1 mm) |
0.394 in (10 mm) |
No |
e3 |
0.394 in (10 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
200 kHz |
1 |
BIMOS |
12 |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.4 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.445 in (36.7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
500 mV |
150 MHz |
1 |
Bipolar |
8 |
175 mA |
0.195 % |
Binary |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-6 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
8 ns |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
420 ns |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
200 kHz |
1 |
12 |
12 V |
Binary, 2's Complement Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
1.445 in (36.7 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.