Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
50 kHz |
1 |
8 |
3.3 V |
Binary |
3/±3 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
2.3 µs |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.283 in (7.2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
1 |
Yes |
512 mV |
10 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SSOP |
Plastic/Epoxy |
4 |
Yes |
5.25 V |
1 |
CMOS |
8 |
5 V |
Complementary Offset Binary |
Small Outline, Shrink Pitch |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
1 |
No |
e0 |
245 °C (473 °F) |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
20 MHz |
2 |
CMOS |
10 |
0.1465 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
40 MHz |
1 |
CMOS |
10 |
0.166 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Quad |
2 µs |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e3 |
0.353 in (8.965 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
1 |
Yes |
512 mV |
10 MHz |
1 |
CMOS |
AEC-Q100 |
8 |
0.3906 % |
3 V |
Offset Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
100 ns |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.25 V |
1 MHz |
1 |
BICMOS |
8 |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.25 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
865 ns |
R-PDIP-T28 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.45 in (36.83 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
3 V |
400 kHz |
1 |
CMOS |
8 |
5 mA |
3.6 V |
Binary |
3.3 V |
Small Outline, Shrink Pitch |
SSOP24,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
2 µs |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.323 in (8.2 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
3 V |
400 kHz |
1 |
CMOS |
8 |
6 mA |
3.6 V |
Binary |
3.3 V |
Small Outline, Shrink Pitch |
SSOP24,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
2 µs |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.323 in (8.2 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
36 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
90 MHz |
2 |
6 |
0.7812 % |
5 V |
Offset Binary |
Small Outline, Shrink Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
1.75 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G36 |
1 |
0.104 in (2.64 mm) |
0.295 in (7.495 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.607 in (15.415 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
4.9 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
2 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
1 |
CMOS |
8 |
5 V |
Complementary Offset Binary |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Quad |
2.4 µs |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.453 in (11.505 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
40 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
40 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
10 |
0.166 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
25 ns |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
20 MHz |
2 |
CMOS |
10 |
0.1465 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
3 V |
400 kHz |
1 |
CMOS |
8 |
6 mA |
3.6 V |
Binary |
3.3 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
2.4 µs |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.3 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Offset Binary |
5,GND/-5 V |
-5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
40 MHz |
1 |
CMOS |
10 |
0.166 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
10 |
0.1465 % |
5 V |
2's Complement Binary |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2 V |
Parallel, Word |
0 °C (32 °F) |
Track |
Dual |
50 ns |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
0.402 in (10.2 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.1 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
2 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.03 in (26.16 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
10 |
0.166 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SSOP |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
1 |
CMOS |
8 |
5 V |
Complementary Offset Binary |
Small Outline, Shrink Pitch |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
1 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
0 mV |
150 MHz |
1 |
CMOS |
8 |
550 mA |
0.293 % |
Binary, 2's Complement Binary |
-5.2 V |
Chip Carrier |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Track |
Quad |
S-CQCC-J44 |
No |
e0 |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
20 MHz |
1 |
CMOS |
10 |
0.1465 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
2 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
0.504 in (12.8 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Offset Binary |
||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Offset Binary |
||||||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
Analog To Digital Converter, Flash Method |
Industrial |
1 |
3 V |
100 MHz |
1 |
CMOS |
6 |
0.5469 % |
5 V |
Binary |
85 °C (185 °F) |
2.2 V |
Parallel, Word |
-40 °C (-40 °F) |
No |
||||||||||||||||||||||||||||||||||
Onsemi |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.1 V |
25 MHz |
1 |
8 |
0.3906 % |
5 V |
Binary |
-5.2 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.705 in (17.9 mm) |
|||||||||||||||||||
Onsemi |
Analog To Digital Converter, Flash Method |
1 |
44 MHz |
1 |
CMOS |
4 |
3.3 V |
Binary |
Parallel, 4 Bits |
No |
||||||||||||||||||||||||||||||||||||||||
Onsemi |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.1 V |
25 MHz |
1 |
8 |
0.3906 % |
5 V |
Binary |
-5.2 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.705 in (17.9 mm) |
|||||||||||||||||||
Onsemi |
Analog To Digital Converter, Flash Method |
1 |
100 MHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
Parallel, 8 Bits |
No |
|||||||||||||||||||||||||||||||||||||||
Onsemi |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.1 V |
25 MHz |
1 |
8 |
0.3906 % |
5 V |
Binary |
-5.2 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2.1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
1.25 in (31.75 mm) |
|||||||||||||||||||||
Onsemi |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.1 V |
25 MHz |
1 |
8 |
0.3906 % |
5 V |
Binary |
-5.2 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Dual |
R-PDSO-G28 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.705 in (17.9 mm) |
|||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
0 mV |
35 MHz |
3 |
CMOS |
6 |
0.9375 % |
5 V |
Binary |
5 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQFP-G44 |
0.083 in (2.1 mm) |
0.394 in (10 mm) |
No |
e3 |
0.394 in (10 mm) |
|||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
15 mA |
0.195 % |
5 V |
Offset Binary |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Dual |
2.5 µs |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.504 in (12.8 mm) |
||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
0.083 in (2.1 mm) |
0.213 in (5.4 mm) |
No |
0.492 in (12.5 mm) |
|||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
3 |
No |
1 |
Bipolar |
6 |
39 mA |
1.1719 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
0.165 in (4.2 mm) |
0.3 in (7.62 mm) |
No |
1.052 in (26.73 mm) |
|||||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.1 V |
1 |
CMOS |
8 |
15 mA |
0.195 % |
5 V |
Offset Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Dual |
2.5 µs |
R-PDIP-T20 |
0.16 in (4.06 mm) |
0.3 in (7.62 mm) |
No |
1.051 in (26.695 mm) |
||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
1 |
Bipolar |
6 |
39 mA |
1.1719 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Dual |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.504 in (12.8 mm) |
|||||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
15 mA |
0.195 % |
5 V |
Offset Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Dual |
2.5 µs |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.504 in (12.8 mm) |
||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
0.083 in (2.1 mm) |
0.213 in (5.4 mm) |
No |
0.492 in (12.5 mm) |
||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
3 |
Yes |
35 MHz |
1 |
CMOS |
6 |
80 mA |
0.9375 % |
5 V |
Binary Coded Decimal |
Flatpack |
0.031 in (0.8 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
0.083 in (2.1 mm) |
0.394 in (10 mm) |
No |
0.394 in (10 mm) |
||||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
5 V |
1 |
Bipolar |
6 |
39 mA |
1.1719 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Dual |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.504 in (12.8 mm) |
|||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
3 |
Yes |
35 MHz |
1 |
CMOS |
6 |
80 mA |
0.9375 % |
5 V |
Binary Coded Decimal |
Flatpack |
0.031 in (0.8 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
0.083 in (2.1 mm) |
0.394 in (10 mm) |
No |
0.394 in (10 mm) |
||||||||||||||||||||||
NXP Semiconductors |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
3 |
No |
5 V |
1 |
Bipolar |
6 |
39 mA |
1.1719 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
0.165 in (4.2 mm) |
0.3 in (7.62 mm) |
No |
1.052 in (26.73 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.