Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
1 |
Yes |
1.024 V |
80 MHz |
1 |
CMOS |
12 |
3.3 V |
2's Complement Binary |
2,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
12.5 ns |
S-XQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
840 mV |
400 MHz |
1 |
6 |
1.5625 % |
5 V |
2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
760 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e3 |
0.472 in (12 mm) |
||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5.25 V |
1 MHz |
1 |
BICMOS |
8 |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.25 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
865 ns |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.203 in (30.545 mm) |
|||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
300 kHz |
1 |
10 |
45 mA |
0.098 % |
5 V |
Offset Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.25 in (31.75 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
1 |
CMOS |
8 |
5 V |
Complementary Offset Binary |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
2.4 µs |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.03 in (26.16 mm) |
||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
1 |
Yes |
1.15 V |
80 MHz |
1 |
CMOS |
12 |
3.3 V |
2's Complement Binary |
2,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.15 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-XQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
No Lead |
20 |
DIE |
1 |
Yes |
3.6 V |
400 kHz |
1 |
8 |
3.3 V |
Binary |
3/±3 V |
Uncased Chip |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
-3.6 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Upper |
2.3 µs |
X-XUUC-N |
No |
e0 |
||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Dual |
2 µs |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.504 in (12.8 mm) |
|||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Ball |
192 |
LBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
525 mV |
1500 MHz |
1 |
Bipolar |
8 |
0.1953 % |
5 V |
Offset Binary |
3.3/5,±5 V |
-5 V |
Grid Array, Low Profile |
BGA192,16X16,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
475 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Bottom |
S-PBGA-B192 |
3 |
0.066 in (1.67 mm) |
0.984 in (25 mm) |
No |
245 °C (473 °F) |
0.984 in (25 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary |
5,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
875 ns |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.03 in (26.16 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
300 kHz |
1 |
10 |
45 mA |
0.098 % |
5 V |
Offset Binary |
±5 V |
-5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Other |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
0 mV |
150 MHz |
1 |
CMOS |
8 |
550 mA |
0.293 % |
Binary, 2's Complement Binary |
-5.2 V |
Chip Carrier |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Track |
Quad |
S-CQCC-J44 |
No |
e0 |
|||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Other |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
0 mV |
300 MHz |
1 |
CMOS |
8 |
550 mA |
0.293 % |
Binary, 2's Complement Binary |
-5.2 V |
Chip Carrier |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Track |
Quad |
S-CQCC-J44 |
No |
e0 |
|||||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.03 in (26.16 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.024 V |
65 MHz |
1 |
CMOS |
12 |
0.0171 % |
3.3 V |
Binary |
2,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e0 |
245 °C (473 °F) |
0.236 in (6 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
4.9 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.504 in (12.8 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Flat |
84 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
290 mV |
500 MHz |
2 |
Bipolar |
8 |
0.293 % |
5 V |
Binary |
-5.2 V |
Flatpack |
0.05 in (1.27 mm) |
70 °C (158 °F) |
205 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
2 ns |
S-CQFP-F84 |
1 |
0.13 in (3.302 mm) |
1.161 in (29.489 mm) |
No |
e0 |
1.161 in (29.489 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
3 V |
400 kHz |
1 |
CMOS |
8 |
6 mA |
3.6 V |
Binary |
3.3 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
40 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
1 MHz |
1 |
BICMOS |
8 |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-5.25 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
865 ns |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
0.402 in (10.2 mm) |
|||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
80 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
840 mV |
800 MHz |
1 |
6 |
1.5625 % |
5 V |
2's Complement Binary |
Flatpack, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
760 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e0 |
0.472 in (12 mm) |
|||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
40 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0.504 in (12.8 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5 V |
1 |
CMOS |
8 |
5 V |
Binary |
Small Outline |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin/Lead |
Track |
Dual |
2.4 µs |
R-PDSO-G28 |
e0 |
||||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Other |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
0 mV |
300 MHz |
1 |
CMOS |
8 |
550 mA |
0.3711 % |
Binary, 2's Complement Binary |
-5.2 V |
Chip Carrier |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Track |
Quad |
S-CQCC-J44 |
No |
e0 |
|||||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
4.9 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
0.504 in (12.8 mm) |
|||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
32 |
TFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
60 MHz |
1 |
CMOS |
10 |
0.1855 % |
3 V |
Offset Binary |
2.7,3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP32,.28SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G32 |
1 |
0.047 in (1.2 mm) |
0.197 in (5 mm) |
No |
e0 |
245 °C (473 °F) |
0.197 in (5 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Other |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
0 mV |
150 MHz |
1 |
CMOS |
8 |
550 mA |
0.3711 % |
Binary, 2's Complement Binary |
-5.2 V |
Chip Carrier |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Track |
Quad |
S-CQCC-J44 |
No |
e0 |
|||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary |
5,GND/-5 V |
-5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
875 ns |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0.504 in (12.8 mm) |
|||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.024 V |
65 MHz |
1 |
CMOS |
12 |
0.0171 % |
3.3 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
0.236 in (6 mm) |
||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
50 kHz |
1 |
8 |
3.3 V |
Binary |
3/±3 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2.3 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Ball |
192 |
LBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
250 mV |
600 MHz |
1 |
Bipolar |
8 |
0.1953 % |
5 V |
Offset Binary |
-5 V |
Grid Array, Low Profile |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-250 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Bottom |
S-PBGA-B192 |
3 |
0.066 in (1.67 mm) |
0.984 in (25 mm) |
No |
e0 |
0.984 in (25 mm) |
||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
3.6 V |
400 kHz |
1 |
8 |
3.3 V |
Binary |
3/±3 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-3.6 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.6 µs |
R-CDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
40 MHz |
1 |
10 |
0.166 % |
3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Quad |
S-PQFP-G48 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
0.276 in (7 mm) |
||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
100 MHz |
1 |
CMOS |
8 |
0.3906 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
1 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
4.9 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-100 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
36 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
90 MHz |
2 |
6 |
0.7812 % |
5 V |
Offset Binary |
Small Outline, Shrink Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
1.75 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G36 |
1 |
0.104 in (2.64 mm) |
0.295 in (7.495 mm) |
No |
e0 |
0.607 in (15.415 mm) |
|||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
10 |
0.1465 % |
5 V |
2's Complement Binary |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
50 ns |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.25 V |
1 |
CMOS |
8 |
5 V |
Complementary Offset Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Track |
Dual |
2.4 µs |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0.606 in (15.4 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Ball |
192 |
LBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
525 mV |
1500 MHz |
1 |
Bipolar |
8 |
0.1953 % |
5 V |
Offset Binary |
-5 V |
Grid Array, Low Profile |
0.05 in (1.27 mm) |
70 °C (158 °F) |
475 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Bottom |
S-PBGA-B192 |
3 |
0.066 in (1.67 mm) |
0.984 in (25 mm) |
No |
e0 |
245 °C (473 °F) |
0.984 in (25 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
80 |
QFP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
0 mV |
750 MHz |
1 |
CMOS |
8 |
1.2 A |
0.3906 % |
Binary |
-5.2 V |
-5.2 V |
Flatpack |
QFP80,.7X.9,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Quad |
R-PQFP-G80 |
0.134 in (3.4 mm) |
0.551 in (14 mm) |
No |
e0 |
0.787 in (20 mm) |
|||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
300 kHz |
1 |
10 |
45 mA |
0.098 % |
5 V |
Offset Binary |
±5 V |
-5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2.5 µs |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
0.606 in (15.4 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.25 V |
1 MHz |
1 |
BICMOS |
8 |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-5.25 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
865 ns |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
0.402 in (10.2 mm) |
|||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
2 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5.1 V |
1 |
CMOS |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-100 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.95 in (24.13 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
1 |
CMOS |
8 |
5 V |
Binary |
5,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
400 ns |
R-GDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.03 in (26.16 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1 |
CMOS |
8 |
5 V |
Binary |
5,GND/-5 V |
-5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
875 ns |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0.504 in (12.8 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.