Analog To Digital Converter, Flash Method Analog-to-Digital Converters 1,746

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX1209ETL+

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

No Lead

40

HVQCCN

Square

1

Yes

1.024 V

80 MHz

1

CMOS

12

3.3 V

2's Complement Binary

2,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

12.5 ns

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

MAX107ECS+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

80

HTFQFP

Square

Plastic/Epoxy

2

Yes

840 mV

400 MHz

1

6

1.5625 %

5 V

2's Complement Binary

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

760 mV

Parallel, Word

-40 °C (-40 °F)

Tin

Quad

S-PQFP-G80

3

0.047 in (1.2 mm)

0.472 in (12 mm)

No

e3

0.472 in (12 mm)

MAX114CNG

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.25 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

865 ns

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX151AMRG

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

300 kHz

1

10

45 mA

0.098 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MX7828LP-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

8

Yes

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Quad

2.4 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

MX7820KN

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.03 in (26.16 mm)

MAX1209ETL+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

No Lead

40

HVQCCN

Square

1

Yes

1.15 V

80 MHz

1

CMOS

12

3.3 V

2's Complement Binary

2,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.15 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

MAX152C/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

20

DIE

1

Yes

3.6 V

400 kHz

1

8

3.3 V

Binary

3/±3 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-3.6 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Upper

2.3 µs

X-XUUC-N

No

e0

MX7820KEWP

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Dual

2 µs

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.504 in (12.8 mm)

MAX108CHC

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Ball

192

LBGA

Square

Plastic/Epoxy

1

Yes

525 mV

1500 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

3.3/5,±5 V

-5 V

Grid Array, Low Profile

BGA192,16X16,50

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

475 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B192

3

0.066 in (1.67 mm)

0.984 in (25 mm)

No

245 °C (473 °F)

0.984 in (25 mm)

MAX153EPP

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

2

No

2.5 V

1 MHz

1

CMOS

8

0.39 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

875 ns

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.03 in (26.16 mm)

MAX151AEWG-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

300 kHz

1

10

45 mA

0.098 %

5 V

Offset Binary

±5 V

-5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.5 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

MAX1114AIBH-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

CMOS

8

550 mA

0.293 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MAX1125AIBH-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

300 MHz

1

CMOS

8

550 mA

0.293 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MX7820LN+

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX1207ETL

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.024 V

65 MHz

1

CMOS

12

0.0171 %

3.3 V

Binary

2,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e0

245 °C (473 °F)

0.236 in (6 mm)

ADC0820CCM-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

4.9 V

1

CMOS

8

15 mA

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.504 in (12.8 mm)

MAX101ACFR-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Flat

84

QFF

Square

Ceramic, Metal-Sealed Cofired

1

Yes

290 mV

500 MHz

2

Bipolar

8

0.293 %

5 V

Binary

-5.2 V

Flatpack

0.05 in (1.27 mm)

70 °C (158 °F)

205 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Quad

2 ns

S-CQFP-F84

1

0.13 in (3.302 mm)

1.161 in (29.489 mm)

No

e0

1.161 in (29.489 mm)

MAX113MRG

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

3 V

400 kHz

1

CMOS

8

6 mA

3.6 V

Binary

3.3 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1195ECM

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

2

Yes

1 V

40 MHz

1

CMOS

8

0.3906 %

3 V

Offset Binary, 2's Complement Binary

3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP48,.35SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

MAX118CAI-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-5.25 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

865 ns

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0.402 in (10.2 mm)

MAX105ECS-D

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

80

TFQFP

Square

Plastic/Epoxy

2

Yes

840 mV

800 MHz

1

6

1.5625 %

5 V

2's Complement Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

760 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G80

3

0.047 in (1.2 mm)

0.472 in (12 mm)

No

e0

0.472 in (12 mm)

MAX1196ECM+D

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

2

Yes

40 MHz

1

CMOS

8

0.3906 %

3 V

Offset Binary, 2's Complement Binary

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

MAX150ACWP

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.504 in (12.8 mm)

AD7828KCWI

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

8

Yes

5 V

1

CMOS

8

5 V

Binary

Small Outline

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin/Lead

Track

Dual

2.4 µs

R-PDSO-G28

e0

MAX1125BIBH-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

300 MHz

1

CMOS

8

550 mA

0.3711 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

ADC0820BCM+

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

4.9 V

1

CMOS

8

15 mA

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.504 in (12.8 mm)

MAX1446EHJ-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

60 MHz

1

CMOS

10

0.1855 %

3 V

Offset Binary

2.7,3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0.197 in (5 mm)

MAX1114BIBH

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

CMOS

8

550 mA

0.3711 %

Binary, 2's Complement Binary

-5.2 V

Chip Carrier

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Track

Quad

S-CQCC-J44

No

e0

MAX153CWP

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

2

Yes

2.5 V

1 MHz

1

CMOS

8

0.39 %

5 V

Binary

5,GND/-5 V

-5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

875 ns

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.504 in (12.8 mm)

MAX1207ETL+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.024 V

65 MHz

1

CMOS

12

0.0171 %

3.3 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

0.236 in (6 mm)

MAX152CWP+

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

50 kHz

1

8

3.3 V

Binary

3/±3 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2.3 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

MAX106CHC-TD

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Ball

192

LBGA

Square

Plastic/Epoxy

1

Yes

250 mV

600 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

-5 V

Grid Array, Low Profile

0.05 in (1.27 mm)

70 °C (158 °F)

-250 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Bottom

S-PBGA-B192

3

0.066 in (1.67 mm)

0.984 in (25 mm)

No

e0

0.984 in (25 mm)

MAX152MJP

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

3.6 V

400 kHz

1

8

3.3 V

Binary

3/±3 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3.6 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.6 µs

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1183ECM/GH9-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

2

Yes

1 V

40 MHz

1

10

0.166 %

3 V

Offset Binary, 2's Complement Binary

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Track

Quad

S-PQFP-G48

0.047 in (1.2 mm)

0.276 in (7 mm)

0.276 in (7 mm)

MAX1198ECM-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

2

Yes

1 V

100 MHz

1

CMOS

8

0.3906 %

3.3 V

Offset Binary, 2's Complement Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

1

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

ADC0820CJ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.9 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1003CAX-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.75 V

90 MHz

2

6

0.7812 %

5 V

Offset Binary

Small Outline, Shrink Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

1.75 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G36

1

0.104 in (2.64 mm)

0.295 in (7.495 mm)

No

e0

0.607 in (15.415 mm)

MAX1425EAI+

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

10

0.1465 %

5 V

2's Complement Binary

3.3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

50 ns

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

MX7824KCWG-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

4

Yes

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Track

Dual

2.4 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.606 in (15.4 mm)

MAX108CHC-TD

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Ball

192

LBGA

Square

Plastic/Epoxy

1

Yes

525 mV

1500 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

-5 V

Grid Array, Low Profile

0.05 in (1.27 mm)

70 °C (158 °F)

475 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Bottom

S-PBGA-B192

3

0.066 in (1.67 mm)

0.984 in (25 mm)

No

e0

245 °C (473 °F)

0.984 in (25 mm)

MAX1151AIZS

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

Gull Wing

80

QFP

Rectangular

Plastic/Epoxy

1

Yes

0 mV

750 MHz

1

CMOS

8

1.2 A

0.3906 %

Binary

-5.2 V

-5.2 V

Flatpack

QFP80,.7X.9,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Quad

R-PQFP-G80

0.134 in (3.4 mm)

0.551 in (14 mm)

No

e0

0.787 in (20 mm)

MAX151ACWG+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

300 kHz

1

10

45 mA

0.098 %

5 V

Offset Binary

±5 V

-5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2.5 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.606 in (15.4 mm)

MAX118EAI-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-5.25 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

865 ns

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0.402 in (10.2 mm)

MAX150BEWP+

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

MX7820UQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

MX7821BQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

CMOS

8

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

400 ns

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MX7821KR

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1

CMOS

8

5 V

Binary

5,GND/-5 V

-5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

875 ns

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.504 in (12.8 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.