Analog To Digital Converter, Flash Method Analog-to-Digital Converters 1,746

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

TDA8706P

NXP Semiconductors

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

3

No

1

Bipolar

6

39 mA

1.1719 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Dual

R-PDIP-T20

0.165 in (4.2 mm)

0.3 in (7.62 mm)

No

1.052 in (26.73 mm)

ADC0820CSEF

NXP Semiconductors

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

WDIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

15 mA

0.39 %

5 V

Offset Binary

In-Line, Window

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.957 in (24.305 mm)

ADC0820BNEN

NXP Semiconductors

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

15 mA

0.195 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Dual

2.5 µs

R-PDIP-T20

0.16 in (4.06 mm)

0.3 in (7.62 mm)

No

1.051 in (26.695 mm)

TDA8706T

NXP Semiconductors

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

3

Yes

5 V

1

Bipolar

6

39 mA

1.1719 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Dual

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.504 in (12.8 mm)

ADC0820CSAN

NXP Semiconductors

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

15 mA

0.39 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Dual

2.5 µs

R-PDIP-T20

0.16 in (4.06 mm)

0.3 in (7.62 mm)

No

1.051 in (26.695 mm)

ADC0820BSEF

NXP Semiconductors

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

WDIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

15 mA

0.195 %

5 V

Offset Binary

In-Line, Window

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.957 in (24.305 mm)

ADC0820CNEN

NXP Semiconductors

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

0.39 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Dual

2.5 µs

R-PDIP-T20

0.16 in (4.06 mm)

0.3 in (7.62 mm)

No

1.051 in (26.695 mm)

TDA8706TD-T

NXP Semiconductors

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

3

Yes

1

Bipolar

6

39 mA

1.1719 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Dual

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.504 in (12.8 mm)

TDA8706N

NXP Semiconductors

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

3

No

1

Bipolar

6

39 mA

3.125 %

5 V

Binary

In-Line

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Dual

R-PDIP-T20

No

ADC0820CSAD

NXP Semiconductors

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

15 mA

0.39 %

5 V

Offset Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Dual

2.5 µs

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.504 in (12.8 mm)

SDA9187-3X

Infineon Technologies

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

13.5 MHz

3

MOS

6

1.5625 %

5 V

Offset Binary, 2's Complement Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.299 in (7.6 mm)

No

0.713 in (18.1 mm)

SDA9205-2

Infineon Technologies

Analog To Digital Converter, Flash Method

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

1

Yes

0 mV

30 MHz

3

CMOS

8

0.3906 %

5 V

Binary, 2's Complement Binary

5 V

Chip Carrier

LDCC68,1.0SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-J68

0.2 in (5.08 mm)

0.953 in (24.21 mm)

No

e0

0.953 in (24.21 mm)

MAX1184ECM-D

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

1

Yes

1 V

20 MHz

2

CMOS

10

0.1465 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

20 s

240 °C (464 °F)

0.276 in (7 mm)

MAX118CPI

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.25 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

865 ns

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

MAX107ECS

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

80

TFQFP

Square

Plastic/Epoxy

2

Yes

840 mV

400 MHz

1

6

1.5625 %

5 V

2's Complement Binary

3.3,5 V

Flatpack, Thin Profile, Fine Pitch

TQFP80,.55SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

760 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G80

3

0.047 in (1.2 mm)

0.472 in (12 mm)

No

e0

0.472 in (12 mm)

ADC0820BJ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.9 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7828LEAI/GG8

Maxim Integrated

Analog To Digital Converter, Flash Method

Offset Binary

MX7824CQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

24

DIP

Ceramic, Glass-Sealed

4

No

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

In-Line

DIP24(UNSPEC)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin/Lead

Track

Dual

2.4 µs

1

No

e0

MAX1426CAI

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

2

Yes

2 V

10 MHz

1

10

0.1465 %

5 V

2's Complement Binary

3.3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

100 ns

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0.402 in (10.2 mm)

MX7828KCWI+

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

8

Yes

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2.4 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

MX7828TQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

8

No

5.25 V

50 kHz

1

CMOS

MIL-STD-883 Class B

8

5 V

Complementary Offset Binary

In-Line

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

2.8 µs

R-CDIP-T28

MAX107ECS-D

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

80

TFQFP

Square

Plastic/Epoxy

2

Yes

840 mV

400 MHz

1

6

1.5625 %

5 V

2's Complement Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

760 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G80

3

0.047 in (1.2 mm)

0.472 in (12 mm)

No

e0

0.472 in (12 mm)

MX7824UQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5.25 V

100 kHz

1

CMOS

MIL-STD-883 Class B

8

5 V

Complementary Offset Binary

In-Line

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

2.8 µs

R-CDIP-T24

MAX1211ETL+

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

No Lead

40

HVQCCN

Square

1

Yes

1 V

65 MHz

1

CMOS

12

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

MAX1426EAI-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

2

Yes

2 V

10 MHz

1

10

0.1465 %

5 V

2's Complement Binary

3.3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

100 ns

R-PDSO-G28

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0.402 in (10.2 mm)

MAX101ACFR

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Flat

84

QFF

Square

Ceramic, Metal-Sealed Cofired

1

Yes

290 mV

500 MHz

2

Bipolar

8

0.293 %

5 V

Binary

5,-5.2 V

-5.2 V

Flatpack

HQFL84,1.16SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

205 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Quad

2 ns

S-CQFP-F84

1

0.13 in (3.302 mm)

1.161 in (29.489 mm)

No

e0

1.161 in (29.489 mm)

MX7821KR-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1

CMOS

8

5 V

Binary

5,GND/-5 V

-5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

875 ns

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.504 in (12.8 mm)

MAX113ENG

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

3 V

400 kHz

1

CMOS

8

6 mA

3.6 V

Binary

3.3 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX150AEWP-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.504 in (12.8 mm)

MX7828LCWI+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

8

Yes

5 V

1

CMOS

8

5 V

Complementary Offset Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2.4 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

MAX152EWP+

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

50 kHz

1

8

3.3 V

Binary

3/±3 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

2.3 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

MAX151BCNG-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

300 kHz

1

10

45 mA

0.098 %

5 V

Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2.5 µs

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX150BEWP-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.504 in (12.8 mm)

MAX150BEWP-TG074

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

e0

0.504 in (12.8 mm)

MX7820KN+

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MX7820UQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

MX7828CQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Ceramic, Glass-Sealed

8

No

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

In-Line

DIP28(UNSPEC)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.4 µs

1

No

e0

20 s

240 °C (464 °F)

MX7821K/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

20

DIE

Rectangular

1

Yes

2.5 V

1

CMOS

8

5 V

Binary

5,GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

875 ns

R-XUUC-N20

1

No

e0

MAX1198ECM

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

2

Yes

1 V

100 MHz

1

CMOS

8

0.3906 %

3.3 V

Offset Binary, 2's Complement Binary

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

245 °C (473 °F)

0.276 in (7 mm)

MAX1196ECM-D

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

2

Yes

40 MHz

1

CMOS

8

0.3906 %

3 V

Offset Binary, 2's Complement Binary

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, 8 Bits

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Track

Quad

S-PQFP-G48

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

20 s

240 °C (464 °F)

0.276 in (7 mm)

MAX152EAP

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

400 kHz

1

8

3.3 V

Binary

3/±3 V

Small Outline, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-3.6 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.3 µs

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0.283 in (7.2 mm)

MAX153MLP

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

8

5 V

Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

MX7828KCWI

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

28

SOP

Plastic/Epoxy

8

Yes

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

Small Outline

SO28(UNSPEC)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin/Lead

Track

Dual

2.4 µs

1

No

e0

MX7820KCWP+

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

MAX1197ECM

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

2

Yes

1 V

60 MHz

1

CMOS

8

0.3906 %

3 V

Offset Binary, 2's Complement Binary

3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP48,.35SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

MX7820BQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

MAX150BEWP+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

15 mA

5 V

Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

2 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

MAX1196ECM+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

2

Yes

1 V

40 MHz

1

CMOS

8

0.3906 %

3 V

Offset Binary, 2's Complement Binary

Flatpack, Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-PQFP-G48

1

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.