DIP Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7713SN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

32 kHz

1

CMOS

1

1 mA

0.0015 %

10 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

1.199 in (30.45 mm)

AD7876BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, 8 Bits, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC912BW883C

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883

12

0.0122 %

5 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC922FT

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

Bipolar

12

45 mA

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7582TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5 V

1

CMOS

12

7.5 mA

0.024 %

15 V

Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

150 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7772KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

76 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, Offset Binary, Comp Binary, 2's Complement Binary, Comp 2's Complement, Comp Offset Binary

5,-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial

0 °C (32 °F)

Tin Lead

Dual

10.2 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

LTC1273ACN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

300 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.7 ms

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

AD1334TD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5 V

28 kHz

1

CMOS

38535Q/M;38534H;883B

12

0.0244 %

15 V

Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

HADC574ZAMJ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

16.5 V

56 kHz

1

CMOS

38535Q/M;38534H;883B

12

9 mA

0.012 %

Binary, 2's Complement Binary

5,12/15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-16.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

25 µs

R-CDIP-T28

No

e0

M38510/14002BXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

MIL-M-38510 Class B

12

0.0244 %

5 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

AD671SD-500/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.0977 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9040AJN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

0 mV

40 MHz

1

BICMOS

10

0.0977 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

5962-8759104LA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883

12

12 mA

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

Yes

e0

AD9005BKM

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

46

DIP

Rectangular

Metal

1

No

1.024 V

10 MHz

1

Bipolar

12

0.0549 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1.024 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.31 in (7.874 mm)

1.3 in (33.02 mm)

No

e0

AD773AKD

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

250 mV

20 MHz

1

BICMOS

10

0.1953 %

5 V

Offset Binary, 2's Complement Binary

5,5,5,-5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-250 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-01-151-2859

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

ADC922BT/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

Bipolar

12

45 mA

0.0244 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1290DCN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

50 kHz

1

CMOS

12

0.0183 %

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

13 µs

R-PDIP-T20

0.3 in (7.62 mm)

No

e3

AD671SD-500

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0977 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

AD1674BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

16.5 V

111 kHz

1

BICMOS

12

18 mA

0.012 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-16.5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

10 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7851AN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

333 kHz

1

CMOS

14

0.0122 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.78 µs

R-PDIP-T24

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e0

1.165 in (29.59 mm)

5962-01-421-7783

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

5 V

1

BICMOS

12

0.012 %

Offset Binary

5,-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

1

No

AD7550BQ/+

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

13

0.012 %

Offset Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T40

e0

ADC908BXMDB

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.29 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

AD7869AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

14

22 mA

0.0122 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD573ALN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

Bipolar

12

0.0122 %

12 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

35 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

PMAD7572AAN10

Analog Devices

Analog To Digital Converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

AD9026BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

31 MHz

1

Bipolar

12

248 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.284 in (7.21 mm)

0.6 in (15.24 mm)

No

e0

1.4 in (35.56 mm)

ADC910BIET

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

10

60 mA

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

12 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD573JN/+

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

Bipolar

10

0.1 %

Offset Binary

5,-12/-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

AD9000SQ/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

1

No

2 V

1

Bipolar

38535Q/M;38534H;883B

6

1.56 %

Offset Binary

5,-5.2 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

AD5214TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

13 µs

R-CDIP-T24

No

e0

AD7820BQ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

8

20 mA

0.39 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

1.36 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7581BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

17 V

1

CMOS

8

8 mA

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-17 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1272-3ACN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

250 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

3 ms

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

AD7574BD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

AD7572LN12/883B

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Sample

Dual

12.5 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

1.227 in (31.165 mm)

LTC1289CCN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

3.05 V

25 kHz

1

CMOS

12

0.0122 %

3 V

2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

26 µs

R-PDIP-T20

0.165 in (4.2 mm)

0.3 in (7.62 mm)

No

e3

AD578ZSD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.0183 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Dual

6 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

LTC1098CN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

6.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

32 µs

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e0

LTC1098CN8#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

6.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

32 µs

R-PDIP-T8

1

0.3 in (7.62 mm)

No

e3

LTC1294BCN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

77 kHz

1

CMOS

12

12 mA

0.0122 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T20

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

LTC1093ACN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

6

No

5.05 V

1

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

20 µs

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

AD7872AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

14

13 mA

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10.5 µs

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

ADADC80-Z-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Gold

Sample

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.6 in (15.24 mm)

No

e4

1.2 in (30.48 mm)

AD7871TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

14

0.0061 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

11 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-01-341-2444

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.098 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

5962-01-177-9190

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T28

No

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.