DIP Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD671KN-750

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

11 V

1.4 MHz

1

CMOS

12

56 mA

0.036 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-6.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

750 ns

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7823YNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

133 kHz

1

8

0.1953 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

4 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.389 in (9.88 mm)

AD7893AN-5

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

6 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

LTC1297BCN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.05 V

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

AD7883BN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

50 kHz

1

BICMOS

12

4 mA

0.0488 %

3.3 V

Binary

3.3 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3.3 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

15 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.485 mm)

LTC1096AIN8#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

9.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDIP-T8

1

0.3 in (7.62 mm)

No

e0

AD9000SDB

Analog Devices

Analog To Digital Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

1

No

2 V

1

Bipolar

MIL-STD-883 Class B (Modified)

6

1.56 %

Offset Binary

5,-5.2 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

AD7892ANZ-2

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

500 kHz

1

CMOS

12

0.0366 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

1.6 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

LTC1276ACN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

300 kHz

1

BICMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

2.7 ms

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

5962-8861501XX

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

5962-8965503LX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9032BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

25 MHz

1

Bipolar

12

0.0488 %

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

93.1 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

LTC1283ACN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

3.05 V

15 kHz

1

CMOS

10

0.0488 %

3 V

Binary, 2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDIP-T20

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

AD977AN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

3

No

10 V

100 kHz

1

BICMOS

16

0.0046 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

8 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

LTC1290BIN#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

50 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5.05 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

13 µs

R-PDIP-T20

1

0.3 in (7.62 mm)

No

e0

5962-8776202VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-STD-883

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

Yes

e0

AD7870AJNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

100 kHz

1

BICMOS

12

13 mA

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.2 in (30.485 mm)

HAS-1409LMB

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

10 V

1

Hybrid

MIL-STD-883 Class B (Modified)

14

0.009 %

Offset Binary, 2's Complement Binary

5,±15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

5962-9474301MXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

16

0.0031 %

12 V

Binary

-12 V

In-Line

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Dual

13.3 µs

R-CDIP-T28

Yes

AD7706BN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3

No

2.5 V

19.2 kHz

1

CMOS

16

0.003 %

3 V

Binary, Offset Binary

3/5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

5962-9306003MXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Automotive

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

12

5 V

2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Dual

R-CDIP-T28

No

AD673JN/+

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

Bipolar

8

0.2 %

Offset Binary

5,-12/-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

AD7880BN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

66 kHz

1

BICMOS

12

10 mA

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

12 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.485 mm)

AD7672UQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9756301HXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

512 mV

100 MHz

1

Bipolar

MIL-STD-883

10

0.2197 %

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-512 mV

Parallel, Word

-55 °C (-67 °F)

Gold

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e4

1.4 in (35.56 mm)

LTC1296BIN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

46.5 kHz

1

CMOS

12

12 mA

0.0122 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5.05 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T20

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

AD7821UQ

Analog Devices

Analog To Digital Converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

1

No

5 V

1

CMOS

8

Offset Binary

5,GND/-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

AD9002SD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

0 mV

150 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.4688 %

Binary

-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

8 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7572BQ12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

13 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD7851ANZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

333 kHz

1

CMOS

14

0.0122 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

2.78 µs

R-PDIP-T24

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e3

1.165 in (29.59 mm)

AD7579JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

7.3 V

50 kHz

1

CMOS

8

10 mA

0.39 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-300 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Sample

Dual

18.5 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7876CNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, 8 Bits, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.25 in (31.75 mm)

5962-01-153-2681

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

15 V

1

CMOS

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

AD7712SN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

12.3 V

160 kHz

1

CMOS

1

4 mA

0.0015 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-6.3 V

Serial

-55 °C (-67 °F)

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

1.199 in (30.45 mm)

AD364RSDB

Analog Devices

Digital To Analog Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

16

No

10 V

MIL-STD-883 Class B (Modified)

12

0.024 %

Binary, Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

ADC71JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

29 kHz

1

16

0.006 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7853BNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

1.25 V

200 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

3.3/5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

4.6 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD1779JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

100 kHz

1

BICMOS

14

32 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8.5 µs

R-CDIP-T28

0.175 in (4.45 mm)

0.6 in (15.24 mm)

No

e0

1.385 in (35.179 mm)

AD679AD

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

ADADC72AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.006 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

PM7572AW12

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9169004MXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

MIL-STD-883

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Dual

R-CDIP-T28

0.17 in (4.32 mm)

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

5962-9063201MLA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

1

CMOS

MIL-STD-883

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

Yes

e0

AD7893BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BIMOS

12

10 mA

0.012 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.5 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962R8512702VXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

12

0.0122 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

Yes

AD9005TM

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

46

DIP

Rectangular

Metal

1

No

1.024 V

1

Bipolar

12

0.073 %

Offset Binary

5,-5.2,±15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T46

No

e0

AD7890BNZ-10

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

10 V

117 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

5.9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.25 in (31.75 mm)

MAX1247BEPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

4

No

1.25 V

133 kHz

1

CMOS

12

0.0244 %

3.6 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

65 µs

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.