DIP Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX154AMRG/883

Analog Devices

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

ICL7109CPL+2

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX1242BCPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

73 MHz

1

CMOS

10

0.0977 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

7.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

ICL7109CPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MX7672KN10+

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

10 V

1

BICMOS

12

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

10 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX192AMJP

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

10

0.0488 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX167CCNG+

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

1

CMOS

12

0.024 %

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

e3

30 s

260 °C (500 °F)

MAX189ACPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

4.096 V

75 kHz

1

CMOS

12

2 mA

0.0122 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

8.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX186ACPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0122 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX158AMJI/883

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

MAX188_CPP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

20

DIP

Rectangular

Plastic/Epoxy

1

No

4.116 V

133 kHz

1

12

5 V

Binary, 2's Complement Binary

-5 V

In-Line

70 °C (158 °F)

-4.116 V

Serial

0 °C (32 °F)

Track

Dual

10 µs

R-PDIP-T20

MAX188CMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

5962-9169101QXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

100 kHz

1

MIL-PRF-38535 Class Q

12

0.0732 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

8.12 µs

R-GDIP-T28

No

e0

MAX158AMDI

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

e0

MAX170DMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Dual

5.6 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

ICL7129ACPA

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

9 V

7-Segment

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

e0

MAX134CPL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

2.8 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX176BMJA/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

250 kHz

1

CMOS

MIL-STD-883 Class B

12

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.405 in (10.29 mm)

5962-8967901QC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

62.5 kHz

1

CMOS

12

0.0122 %

5 V

Binary, Offset Binary

-5 V

In-Line

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

12.25 µs

R-GDIP-T40

No

e4

MAX187ACPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

4.096 V

75 kHz

1

CMOS

12

2.5 mA

0.0122 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

8.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX120CNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

500 kHz

1

BICMOS

12

0.024 %

5 V

2's Complement Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

1.63 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MX7574TD/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MAX186BMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

ICL7106RCPL

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

9 V

Offset Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

1

e0

5962-8967401QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

56 kHz

1

CMOS

MIL-STD-883

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

14.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX166ACPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

2.58 V

200 kHz

1

CMOS

8

6 mA

0.195 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

5962-8967601QA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX191BCNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5.25 V

Serial, Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

18 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX188CCPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0183 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX188DCPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX187CEPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

4.096 V

75 kHz

1

CMOS

12

2.5 mA

0.0488 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

8.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX186CEPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX150BCPP+

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

2 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX1241ACPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.3 V

73 kHz

1

BICMOS

12

0.0122 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

7.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX1241BCPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.3 V

73 kHz

1

BICMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

7.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX144BMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1416EPE+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2

No

1

BICMOS

16

0.0015 %

3 V

Binary, Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

Serial

-45 °C (-49 °F)

Matte Tin - annealed

Track

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

MAX172AENG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0122 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

10.4 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX133CPL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

2.8 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX180CCPL+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

MAX133EPL+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

2.8 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

MAX157BMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0977 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX174CMJ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

8 µs

R-GDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

ICL7129CJL

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Ceramic

1

No

2 V

1

CMOS

9 V

7-Segment

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T40

e0

5962-8967402QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

56 kHz

1

CMOS

MIL-STD-883

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

14.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX176BCPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0183 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX1241BMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5.3 V

73 kHz

1

BICMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

MAX1170CDJ

Analog Devices

Analog To Digital Converter, Flash/Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

10 MHz

1

CMOS

12

150 mA

5 V

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-CDIP-T32

0.21 in (5.33 mm)

0.6 in (15.24 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.