Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

5962-8876402LB

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD572SM/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Metal

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T32

No

e0

AD779TJ

Analog Devices

Analog To Digital Converter, Flash Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

18 V

128 kHz

1

BIMOS

14

34 mA

0.012 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

Chip Carrier

LCC44,.65SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-18 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

7.8 µs

S-CQCC-J44

0.135 in (3.43 mm)

0.645 in (16.385 mm)

No

e0

0.645 in (16.385 mm)

5962-87591063X

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

MIL-STD-883

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

5 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD9034TD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

20.48 MHz

1

CMOS

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.024 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

49 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

5962-8961604VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

8

0.293 %

5 V

Binary

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

15 µs

R-GDIP-T18

No

5962-01-165-0874

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

No

20 V

1

Hybrid

38535Q/M;38534H;883B

10

0.073 %

Binary, Complementary Binary, Offset 2's Complement, Offset Binary, Complementary Offset Binary, 2's Complement

5,±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

M38510/14002BXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

12

0.0122 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

5962-8865803XA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.018 %

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

e0

1.62 in (41.15 mm)

AD363RSD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

64

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

16

No

10 V

30 kHz

1

Hybrid

12

0.0244 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

25 µs

R-CDIP-T64

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

5962-9092702MXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

0 mV

35 MHz

1

Bipolar

MIL-STD-883

8

110 mA

0.293 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-89654023A

Analog Devices

Analog To Digital Converter

Military

No Lead

28

QCCN

Square

Ceramic

1

Yes

100 mV

1

Bipolar

38535Q/M;38534H;883B

8

0.47 %

Offset Binary

5,-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead - hot dipped

Quad

S-XQCC-N28

No

e0

5962-8861502XX

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

AD7824UQ/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

100 kHz

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9316401MXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

MIL-STD-883

12

18 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

5962-01-358-5651

Analog Devices

Analog To Digital Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

100 mV

1

Bipolar

38535Q/M;38534H;883B

8

0.47 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

AD7579SE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

2.5 V

50 kHz

1

CMOS

38535Q/M;38534H;883B

10

10 mA

0.0977 %

5 V

Binary

5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Quad

18.5 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-9158102MYX

Analog Devices

Analog To Digital Converter

Military

Gull Wing

68

QFP

Square

Ceramic

1

Yes

1.75 V

1

Bipolar

38535Q/M;38534H;883B

10

0.19 %

Binary

5,-5.2 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQFP-G68

No

5962-8876404XC

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-9861401QRA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3

No

10 V

200 kHz

1

BICMOS

MIL-PRF-38535 Class Q

16

0.0038 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Serial

-55 °C (-67 °F)

Tin Lead

Dual

4 µs

R-CDIP-T20

No

e0

AD7572SE05

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

5.2 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

PM7572ATC05

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

-15 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

5.2 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-8865001RC

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

AD9058TD/883

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

50 MHz

2

MIL-STD-883

8

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T48

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

2.4 in (60.96 mm)

ADC912BW

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

7 mA

0.0122 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9005BTM

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

46

DIP

Rectangular

Metal

1

No

1.024 V

10 MHz

1

Bipolar

12

0.0549 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.024 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.31 in (7.874 mm)

1.3 in (33.02 mm)

No

e0

AD364RSD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

60

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

16

No

10 V

25 kHz

1

12

0.024 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

32 µs

R-CDIP-T60

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

5962-8776202VB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

8

7 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9002TE

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

100 mV

150 MHz

1

Bipolar

8

0.4688 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2.1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD7820TCHIPS

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

DIE

1

Yes

5 V

1

CMOS

8

0.3906 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Upper

1.36 µs

X-XUUC-N20

No

V62/12647-01XB

Analog Devices

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

5 V

CMOS

12

0.024 %

Binary, 2's Complement Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

AD9042SF/QMLV

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

2.9 V

41 MHz

1

12

5 V

Binary

Flatpack

125 °C (257 °F)

1.9 V

Parallel, Word

-55 °C (-67 °F)

Track

Dual

200 ns

R-CDFP-F28

AD7711SR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

12.3 V

160 kHz

1

CMOS

21

4 mA

0.0015 %

10 V

Binary

-5 V

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-6.3 V

Serial

-55 °C (-67 °F)

Dual

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.606 in (15.4 mm)

AD9020SZ/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

60 MHz

1

Bipolar

MIL-STD-883

10

0.2686 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

Flatpack

QFP68,1.2SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-1.75 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

S-CQFP-G68

0.143 in (3.622 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

ADC7672TQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

5962-8961601VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

MIL-STD-883

8

0.1172 %

5 V

Binary, Offset Binary

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Dual

6 µs

R-GDIP-T18

No

e0

AD9038TZ/883B

Analog Devices

Analog To Digital Converter

Military

Gull Wing

68

QFP

Square

Ceramic

1

Yes

1

Bipolar

38535Q/M;38534H;883B

8

0.39 %

Offset Binary

-5.2 V

-5.2 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQFP-G68

No

e0

AD5202TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

50 µs

R-CDIP-T24

No

e0

AD9016TZ/883B

Analog Devices

Analog To Digital Converter

Military

Gull Wing

68

QFP

Square

Ceramic

1

Yes

1 V

1

Bipolar

38535Q/M;38534H;883B

6

0.78 %

Binary

5,-5.2 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQFP-G68

No

e0

AD9028SE/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

325 MHz

1

Bipolar

8

475 mA

0.39 %

Offset Binary, 2's Complement Binary

-5.2 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-6 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

3.3 ns

S-CQCC-N68

0.103 in (2.62 mm)

0.953 in (24.195 mm)

No

e0

0.953 in (24.195 mm)

AD5211TD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

5962-01-176-3707

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

12

0.024 %

Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

AD578ZTD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.0183 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

4.5 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

AD9000SDB

Analog Devices

Analog To Digital Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

1

No

2 V

1

Bipolar

MIL-STD-883 Class B (Modified)

6

1.56 %

Offset Binary

5,-5.2 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

5962-8861501XX

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

5962-8965503LX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8776202VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-STD-883

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

Yes

e0

5962-9474301MXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

16

0.0031 %

12 V

Binary

-12 V

In-Line

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Dual

13.3 µs

R-CDIP-T28

Yes

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.