Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX1241AMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5.3 V

73 kHz

1

BICMOS

12

0.0122 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

5962-9169202Q3C

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Quad

40.63 µs

S-CQCC-N28

No

e4

MX7574TQ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MX7572TQ05/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

5.2 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

MAX157AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0488 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX188DMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MX7672UE10+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

HQCCN

Square

2

Yes

64.5 kHz

1

BICMOS

12

0.0183 %

5 V

Binary

-12 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

10 µs

S-XQCC-N28

0.1 in (2.54 mm)

0.451 in (11.455 mm)

0.451 in (11.455 mm)

MX7828TQ/883

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

MAX186CMLP/883B

Analog Devices

Military

No Lead

20

QCCN

Square

Plastic/Epoxy

8

Yes

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-PQCC-N20

No

5962-8967402XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

4.52 V

55.6 kHz

1

CMOS

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Quad

14.25 µs

S-CQCC-N44

No

e4

5962-8512702XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

MIL-PRF-38535

12

0.0122 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDIP-T28

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

MAX187BMJA/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

4.15 V

75 kHz

1

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

8.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

5962-9169201QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0046 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

40.63 µs

R-GDIP-T28

No

e4

MAX144AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0122 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX188_MJP

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

20

DIP

Rectangular

Ceramic

1

No

4.116 V

133 kHz

1

MIL-STD-883

12

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.116 V

Serial

-55 °C (-67 °F)

Track

Dual

10 µs

R-CDIP-T20

MAX154BMRG/883

Analog Devices

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

MAX160MLP/883B

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

MX7672TE05+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

HQCCN

Square

2

Yes

125 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

-12 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

5 µs

S-XQCC-N28

0.1 in (2.54 mm)

0.451 in (11.455 mm)

0.451 in (11.455 mm)

MAX158BMJI/883

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

5962-8967601XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

16.25 µs

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

MAX1240BMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

3.65 V

73 kHz

1

BICMOS

12

0.0244 %

3 V

Binary

3/3.3 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

MAX161BMJI

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

8

5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX162AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

3.25 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX159AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0488 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574SQ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

5962-8967602XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

16.25 µs

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

MAX158BMDI

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

e0

5962-9169202QXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

40.63 µs

R-GDIP-T28

No

e0

MAX1240AMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

3.65 V

73 kHz

1

BICMOS

12

0.0122 %

3 V

Binary

3/3.3 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

5962-8967901QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

63 kHz

1

CMOS

MIL-STD-883

12

0.0122 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

12.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX186AMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MAX188DMLP/883B

Analog Devices

Military

No Lead

20

QCCN

Square

Plastic/Epoxy

8

Yes

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-PQCC-N20

No

MAX184BMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX184AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.018 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX185AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.018 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX185BMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

5962R0253801VZA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Flat

28

QFF

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

41 MHz

1

Bipolar

MIL-PRF-38535 Class V

12

0.085 %

5 V

2's Complement Binary

5 V

Flatpack

FL28,.5

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDFP-F28

Yes

e0

5962-9463701MYX

Analog Devices

Analog To Digital Converter

Military

No Lead

68

QCCN

Square

Ceramic

1

Yes

1.75 V

1

Bipolar

38535Q/M;38534H;883B

10

0.24 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N68

No

AD7891SP

Analog Devices

Analog To Digital Converter Subsystem

Military

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary

Flatpack

0.031 in (0.8 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

10 µs

S-PQFP-G44

0.096 in (2.44 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

AD7478SRT

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

1 MHz

1

CMOS

8

0.1953 %

3 V

Binary

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

800 ns

R-PDSO-G6

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

240 °C (464 °F)

0.114 in (2.9 mm)

5962R0253801VZX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Flat

28

QFF

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

41 MHz

1

12

5 V

2's Complement Binary

Flatpack

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

R-CDFP-F28

Yes

AD7572SE05/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

5.2 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD872SD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

38535Q/M;38534H;883B

12

150 mA

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7710SQ/883B

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

1

CMOS

MIL-STD-883 Class B

24

0.003 %

5 V

Binary, Offset Binary

±5/10 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9050802MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

125 MHz

1

Bipolar

8

0.1953 %

Binary

-5.2 V

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

AD6700703D

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

8

45 mA

0.390625 %

5 V

Offset Binary, 2's Complement Binary

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

13 µs

R-CDIP-T20

5962-9092702M3A

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

35 MHz

1

Bipolar

MIL-STD-883

8

110 mA

0.293 %

5 V

Binary

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-8763501RA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5 V

1

Bipolar

38535Q/M;38534H;883B

8

45 mA

0.4 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

3.4 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.