Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD578ZTD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0183 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

4.5 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

AD7878TE

Analog Devices

Analog To Digital Converter

Military

No Lead

28

QCCN

Square

Ceramic

1

Yes

3 V

1

BICMOS

12

5 V

Offset 2's Complement, 2's Complement

±5 V

-5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

AD872SD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

12

150 mA

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

100 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7828UQ/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

50 kHz

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7572ASQ03/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD9048TQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

100 mV

38 MHz

1

Bipolar

8

0.293 %

5 V

Binary, Offset 2's Complement

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

29 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

V62/12635-01XB

Analog Devices

Military

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

16

Yes

12

0.024 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G28

AD7490SRU-EP-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

16

Yes

5 V

1 MHz

1

12

0.0244 %

5 V

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

800 ns

R-PDSO-G28

0.047 in (1.2 mm)

0.173 in (4.4 mm)

0.382 in (9.7 mm)

AD9034D/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

40

DIP

Rectangular

Metal

1

No

1.024 V

20 MHz

1

CMOS

38535Q/M;38534H;883B

12

760 mA

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-MDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9060TZ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

10

5 V

Offset Binary, 2's Complement Binary

-5.2 V

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

-1.75 V

Parallel, Word

-55 °C (-67 °F)

Quad

S-CQFP-G68

0.143 in (3.622 mm)

0.95 in (24.13 mm)

No

0.95 in (24.13 mm)

HADC674ZBMD/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T28

0.17 in (4.32 mm)

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

AD7574SE

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

15 V

1

CMOS

8

0.3 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

AD7477SRT-REEL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

1 MHz

1

CMOS

10

0.0977 %

3 V

Binary

2.5/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

800 ns

R-PDSO-G6

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

0.114 in (2.9 mm)

AD9002TQ/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

100 mV

1

Bipolar

38535Q/M;38534H;883B

8

0.47 %

Binary

-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD5202SD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD674ASD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

16.5 V

83 kHz

1

BIMOS

12

40 mA

0.024 %

Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-16.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

15 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD779SD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-01-109-7823

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.098 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

AD7824TQ/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

100 kHz

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD575SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP14,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Dual

30 µs

R-CDIP-T14

0.13 in (3.31 mm)

0.3 in (7.62 mm)

No

e0

0.7 in (17.78 mm)

AD9011TMB

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

MIL-STD-883 Class B (Modified)

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

AD678SD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

200 kHz

1

BIMOS

12

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD9253TCPZ-125EP

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

48

HVQCCN

Square

4

Yes

2 V

125 MHz

1

CMOS

14

0.0275 %

1.8 V

2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-2 V

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Quad

100 ns

S-XQCC-N48

3

0.031 in (0.8 mm)

0.276 in (7 mm)

e4

0.276 in (7 mm)

SP674AT/B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.17 in (4.32 mm)

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

ADC1111

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Pin/Peg

34

DMA

Rectangular

Plastic/Epoxy

1

No

15 V

1

12

275 mA

0.0122 %

15 V

Offset Binary, 2's Complement Binary, Complementary 2's Complement, Complementary Offset Binary

-15 V

Microelectronic Assembly

125 °C (257 °F)

-15 V

Parallel, Word

-55 °C (-67 °F)

Gold

Dual

25 µs

R-PDMA-P34

0.421 in (10.7 mm)

2 in (50.8 mm)

No

e4

4 in (101.6 mm)

5962-8776201VC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

8

7 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Gold

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

5962-8965502LA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7821TQ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1 MHz

1

CMOS

MIL-STD-883 Class B

8

0.3906 %

5 V

Binary, Offset Binary

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

660 ns

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962R8512702VZX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Flat

28

QFF

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

1

12

0.0122 %

15 V

Binary

-15 V

Flatpack

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDFP-F28

Yes

AD679SJ

Analog Devices

Analog To Digital Converter, Flash Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

Chip Carrier

LCC44,.65SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

6.3 µs

S-CQCC-J44

0.135 in (3.42 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

AD7574SE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

15 V

1

CMOS

MIL-STD-883 Class B

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-15 V

Parallel, 8 Bits

-55 °C (-67 °F)

Gold

Quad

15 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e4

0.35 in (8.89 mm)

AD9060SE

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

10

5 V

Offset Binary, 2's Complement Binary

-5.2 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-1.75 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

5962-9475901MXA

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

40 MHz

1

MIL-STD-883

10

0.2441 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-GDIP-T28

No

e0

AD774BTD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

8 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD578SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

6 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

5962-9169003MXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

MIL-STD-883

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.17 in (4.32 mm)

0.6 in (15.24 mm)

Yes

e0

1.399 in (35.54 mm)

AD7874SQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

15 V

29 kHz

1

CMOS

MIL-STD-883 Class B

12

18 mA

0.024 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

10 V

-55 °C (-67 °F)

Tin Lead

Track

Dual

35 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.52 in (13.2 mm)

No

e0

1.49 in (37.84 mm)

5962-9463701MYA

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

HQCCN

Square

1

Yes

60 MHz

1

MIL-STD-883

10

0.293 %

5 V

Binary

-5 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

16.6 ns

S-XQCC-N68

0.113 in (2.87 mm)

0.95 in (24.13 mm)

0.95 in (24.13 mm)

AD7580SE

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

7.3 V

50 kHz

1

CMOS

10

10 mA

0.098 %

5 V

Binary

5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Quad

18.5 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-8965501LC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD774BTD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

MIL-STD-883 Class B

12

14 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

8 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD364SD/883B

Analog Devices

Digital To Analog Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

16

No

10 V

38535Q/M;38534H;883B

12

0.024 %

Binary, Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

ADADC-816SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

10

0.0488 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

900 ns

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

AD7891SE

Analog Devices

Analog To Digital Converter Subsystem

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

10 µs

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.5354 mm)

No

e0

0.651 in (16.5354 mm)

AD7713SR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

32 kHz

1

CMOS

1

1 mA

0.0015 %

10 V

Offset Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Dual

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.606 in (15.4 mm)

AD7572SQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

5962-9092701M3X

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

35 MHz

1

MIL-STD-883

8

0.293 %

5 V

Binary

-5.2 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

V62/12640-01XE

Analog Devices

Analog To Digital Converter

Military

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

1

16

0.002 %

Binary

2.5,2.5/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G10

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.