Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
12 |
0.0183 % |
12 V |
Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
4.5 µs |
R-CDIP-T32 |
0.275 in (6.98 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic |
1 |
Yes |
3 V |
1 |
BICMOS |
12 |
5 V |
Offset 2's Complement, 2's Complement |
±5 V |
-5 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-XQCC-N28 |
No |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
12 |
150 mA |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
100 ns |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
5 V |
50 kHz |
1 |
BICMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
1 |
No |
5 V |
1 |
BICMOS |
38535Q/M;38534H;883B |
12 |
0.024 % |
Offset Binary |
5,-12/-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
100 mV |
38 MHz |
1 |
Bipolar |
8 |
0.293 % |
5 V |
Binary, Offset 2's Complement |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.1 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
29 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Military |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
12 |
0.024 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G28 |
|||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
5 V |
1 MHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Track |
Dual |
800 ns |
R-PDSO-G28 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
0.382 in (9.7 mm) |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Metal |
1 |
No |
1.024 V |
20 MHz |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
760 mA |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-MDIP-T40 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.75 V |
75 MHz |
1 |
10 |
5 V |
Offset Binary, 2's Complement Binary |
-5.2 V |
Flatpack |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-1.75 V |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
S-CQFP-G68 |
0.143 in (3.622 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
12 |
0.0244 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
R-CDIP-T28 |
0.17 in (4.32 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.399 in (35.54 mm) |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic |
1 |
Yes |
15 V |
1 |
CMOS |
8 |
0.3 % |
5 V |
Offset Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-XQCC-N20 |
No |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
1 MHz |
1 |
CMOS |
10 |
0.0977 % |
3 V |
Binary |
2.5/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Analog to Digital Converters |
0.037 in (0.95 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
800 ns |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
e0 |
0.114 in (2.9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
1 |
No |
100 mV |
1 |
Bipolar |
38535Q/M;38534H;883B |
8 |
0.47 % |
Binary |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
1 |
No |
10 V |
1 |
Hybrid |
38535Q/M;38534H;883B |
12 |
0.012 % |
Complementary Offset Binary |
5,±15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
16.5 V |
83 kHz |
1 |
BIMOS |
12 |
40 mA |
0.024 % |
Binary |
5,±12/±15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-16.5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
15 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
12 V |
Binary, 2's Complement Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
6.3 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
10 |
0.098 % |
Offset Binary |
5,-15 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T18 |
No |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
100 kHz |
1 |
BICMOS |
8 |
20 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
14 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
10 |
0.0977 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-12 V |
In-Line |
DIP14,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Dual |
30 µs |
R-CDIP-T14 |
0.13 in (3.31 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.7 in (17.78 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
1 |
No |
1 V |
100 MHz |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
8 |
303 mA |
0.4688 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.3205 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
200 kHz |
1 |
BIMOS |
12 |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
4.4 µs |
R-CDIP-T28 |
0.165 in (4.191 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0275 % |
1.8 V |
2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
100 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e4 |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
12 |
0.0244 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.17 in (4.32 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.399 in (35.54 mm) |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Pin/Peg |
34 |
DMA |
Rectangular |
Plastic/Epoxy |
1 |
No |
15 V |
1 |
12 |
275 mA |
0.0122 % |
15 V |
Offset Binary, 2's Complement Binary, Complementary 2's Complement, Complementary Offset Binary |
-15 V |
Microelectronic Assembly |
125 °C (257 °F) |
-15 V |
Parallel, Word |
-55 °C (-67 °F) |
Gold |
Dual |
25 µs |
R-PDMA-P34 |
0.421 in (10.7 mm) |
2 in (50.8 mm) |
No |
e4 |
4 in (101.6 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.46 V |
1 |
BICMOS |
8 |
7 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Gold |
Track |
Dual |
15 µs |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
12 mA |
0.0244 % |
5 V |
Binary |
5,-12 V |
-12 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
10.4 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
1 MHz |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
0.3906 % |
5 V |
Binary, Offset Binary |
5,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
660 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Flat |
28 |
QFF |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 |
12 |
0.0122 % |
15 V |
Binary |
-15 V |
Flatpack |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
24 µs |
R-CDFP-F28 |
Yes |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
Chip Carrier |
LCC44,.65SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Quad |
6.3 µs |
S-CQCC-J44 |
0.135 in (3.42 mm) |
0.65 in (16.51 mm) |
No |
e0 |
0.65 in (16.51 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
15 V |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
0.293 % |
5 V |
Binary, Offset Binary, Complementary Offset Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-15 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Gold |
Quad |
15 µs |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e4 |
0.35 in (8.89 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
68 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1.75 V |
75 MHz |
1 |
10 |
5 V |
Offset Binary, 2's Complement Binary |
-5.2 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-1.75 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N68 |
0.118 in (2.997 mm) |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
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Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
40 MHz |
1 |
MIL-STD-883 |
10 |
0.2441 % |
5 V |
Offset Binary |
±5 V |
-5 V |
In-Line |
DIP28,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-GDIP-T28 |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
BICMOS |
12 |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
8 µs |
R-CDIP-T28 |
0.145 in (3.68 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B |
12 |
0.0183 % |
15 V |
Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
6 µs |
R-CDIP-T32 |
0.275 in (6.98 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.612 in (40.945 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
MIL-STD-883 |
12 |
0.0244 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.17 in (4.32 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
1.399 in (35.54 mm) |
||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
15 V |
29 kHz |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
18 mA |
0.024 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
10 V |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
35 µs |
R-GDIP-T28 |
0.22 in (5.59 mm) |
0.52 in (13.2 mm) |
No |
e0 |
1.49 in (37.84 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
68 |
HQCCN |
Square |
1 |
Yes |
60 MHz |
1 |
MIL-STD-883 |
10 |
0.293 % |
5 V |
Binary |
-5 V |
Chip Carrier, Heat Sink/Slug |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Quad |
16.6 ns |
S-XQCC-N68 |
0.113 in (2.87 mm) |
0.95 in (24.13 mm) |
0.95 in (24.13 mm) |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
7.3 V |
50 kHz |
1 |
CMOS |
10 |
10 mA |
0.098 % |
5 V |
Binary |
5 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-300 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Quad |
18.5 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
12 mA |
0.0244 % |
5 V |
Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
10.4 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
BICMOS |
MIL-STD-883 Class B |
12 |
14 mA |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
8 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
38535Q/M;38534H;883B |
12 |
0.024 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T32 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
10 |
0.0488 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
900 ns |
R-CDIP-T32 |
0.28 in (7.11 mm) |
0.9 in (22.86 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-10 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.5354 mm) |
No |
e0 |
0.651 in (16.5354 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Military |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
32 kHz |
1 |
CMOS |
1 |
1 mA |
0.0015 % |
10 V |
Offset Binary |
Small Outline |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Dual |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.606 in (15.4 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
5.2 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
35 MHz |
1 |
MIL-STD-883 |
8 |
0.293 % |
5 V |
Binary |
-5.2 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
0.45 in (11.43 mm) |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter |
Military |
Gull Wing |
10 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
1 |
16 |
0.002 % |
Binary |
2.5,2.5/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G10 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.