Military Analog-to-Digital Converters 1,814

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7575SCHIPS

Analog Devices

Analog To Digital Converter

Military

1

2.46 V

1

CMOS

8

0.4 %

5 V

Binary, Offset Binary

5 V

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

-55 °C (-67 °F)

No

AD9028SZ/883B

Analog Devices

Analog To Digital Converter

Military

Gull Wing

68

QFP

Square

Ceramic

1

Yes

1

Bipolar

38535Q/M;38534H;883B

8

0.47 %

Offset Binary

-5.2 V

-5.2 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQFP-G68

No

e0

AD679SJ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

128 kHz

1

BICMOS

38535Q/M;38534H;883B

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

Chip Carrier

LCC44,.65SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

6.3 µs

S-CQCC-J44

0.135 in (3.42 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

5962-8865803XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.018 %

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

1.62 in (41.15 mm)

AD678SJ

Analog Devices

Analog To Digital Converter, Flash Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

18 V

200 kHz

1

BIMOS

12

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-18 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

4.4 µs

S-CQCC-J44

0.135 in (3.43 mm)

0.645 in (16.385 mm)

No

e0

0.645 in (16.385 mm)

AD1671-703F

Analog Devices

Analog To Digital Converter, Flash Method

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1.25 MHz

1

BICMOS

38535V;38534K;883S

12

0.061 %

5 V

Binary

±5 V

-5 V

Flatpack

FL28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

800 ns

R-CDFP-F28

No

HAS-0802MB

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Metal

1

No

1

Bipolar

38535Q/M;38534H;883B

8

Offset Binary

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

5962-9684601QLX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

600 kHz

1

CMOS

12

5 V

2's Complement Binary

In-Line

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

1.68 µs

R-GDIP-T24

Yes

PM0820AR

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7582TE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

4

Yes

5 V

1

CMOS

38535Q/M;38534H;883B

12

7.5 mA

15 V

Binary

±5,15 V

-5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

150 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD670-000C

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

20

DIE

Rectangular

1

Yes

1

8

5 V

Binary

Uncased Chip

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Upper

10 µs

R-XUUC-N20

AD574AUE/883BC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

16.5 V

1

Bipolar

12

0.0244 %

15 V

Binary

-15 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-16.5 V

Parallel, Word

-55 °C (-67 °F)

Quad

35 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

0.45 in (11.43 mm)

AD574TD

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

12

0.024 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

5962-88650012B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

8

20 mA

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Quad

2.5 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

5962-8776201VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

38535Q/M;38534H;883B

8

7 mA

0.2 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD574SD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

Bipolar

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

5962-01-252-1496

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.098 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

5962-9092702M3X

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

35 MHz

1

MIL-STD-883

8

0.3906 %

5 V

Binary

-5.2 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

AD9020TE/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

60 MHz

1

Bipolar

38535Q/M;38534H;883B

10

542 mA

0.1953 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N68

0.103 in (2.62 mm)

0.953 in (24.195 mm)

No

e0

0.953 in (24.195 mm)

AD1671-713F

Analog Devices

Analog To Digital Converter, Flash Method

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1.25 MHz

1

BICMOS

38535V;38534K;883S

12

0.061 %

5 V

Binary

±5 V

-5 V

Flatpack

FL28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

800 ns

R-CDFP-F28

No

AD7714SQ-5

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5

No

2.5 V

1

CMOS

24

0.0015 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

AD9032TD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

25 MHz

1

CMOS

38535Q/M;38534H;883B

12

672 mA

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-9961003HXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

2

Yes

5 V

105 MHz

1

MIL-PRF-38534 Class H

12

0.0732 %

5 V

Binary

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Quad

9.5 µs

S-CQFP-G68

0.31 in (7.87 mm)

0.95 in (24.13 mm)

Yes

0.95 in (24.13 mm)

AD7884TQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

16

30 mA

0.003 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-7.3 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

5.3 µs

R-GDIP-T40

0.21 in (5.33 mm)

0.6 in (15.24 mm)

No

e0

5962-01-367-2092

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

15 V

1

CMOS

8

0.3 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

AD9028TE/883B

Analog Devices

Analog To Digital Converter

Military

No Lead

68

QCCN

Square

Ceramic

1

Yes

1

Bipolar

38535Q/M;38534H;883B

8

0.39 %

Offset Binary

-5.2 V

-5.2 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N68

No

e0

ADC85S-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

10

140 mA

0.048 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e0

1.612 in (40.945 mm)

AD9467SCPZ-250-EP

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

72

HVQCCN

Square

1

Yes

2.5 V

250 MHz

1

16

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-XQCC-N72

3

0.035 in (0.9 mm)

0.394 in (10 mm)

e4

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC908AXMDX

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

5962-8876403XB

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-9312601MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

MIL-STD-883

12

0.061 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

5962-9475501MPA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

MIL-STD-883

12

0.024 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

AD5211TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

12

0.0122 %

15 V

Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

13 µs

R-CDIP-T24

No

e0

5962-9551901MLX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 MHz

1

BICMOS

MIL-STD-883

12

0.0977 %

5 V

Binary

-5 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

500 ns

R-CDIP-T24

No

5962-8865801XA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.018 %

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

e0

1.62 in (41.15 mm)

5962-9559201MEX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

16

0.0031 %

12 V

Binary

-12 V

In-Line

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Dual

R-CDIP-T16

Yes

5962-8680203VVX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

10

5 V

Binary

-15 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

Yes

e0

AD678SD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

38535Q/M;38534H;883B

12

34 mA

0.0488 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

HADC674ZAMC/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

12

0.0244 %

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Sample

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

AD7572UQ12/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

13 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD670SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

1.27 V

1

Bipolar

8

45 mA

0.39 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.28 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8512702VZX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Flat

28

QFF

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

1

12

0.0122 %

15 V

Binary

-15 V

Flatpack

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDFP-F28

No

5962-8969802LA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

1

CMOS

10

10 mA

0.0977 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

18.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD872SE

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

10 MHz

1

BICMOS

12

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LCC44,.65SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.545 mm)

No

e0

0.651 in (16.545 mm)

ADAQ7988BCCZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

24

QCCN

Rectangular

1

Yes

1 V

500 kHz

1

16

0.002 %

5 V

Binary

Chip Carrier

0.02 in (0.5 mm)

125 °C (257 °F)

-1 V

Serial

-55 °C (-67 °F)

Quad

1.2 µs

R-XQCC-N24

3

0.082 in (2.08 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0.197 in (5 mm)

5962-9961001HXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

2

Yes

105 MHz

2

12

3.3 V

2's Complement Binary

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Track

Quad

S-CQFP-G68

0.143 in (3.622 mm)

0.95 in (24.13 mm)

No

0.95 in (24.13 mm)

AD16710713F

Analog Devices

Analog To Digital Converter, Flash Method

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1.25 MHz

1

12

0.07324 %

5 V

Binary

-5 V

Flatpack

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

800 ns

R-CDFP-F28

5962-87591033A

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

MIL-STD-883

12

0.0122 %

5 V

Binary

-15 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

12.5 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.