Through-Hole Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX162AING

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

5962-8967602QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX120ENG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

500 kHz

1

BICMOS

12

0.0244 %

5 V

2's Complement Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

1.63 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX170DEPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Dual

5.6 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MX674AJEPI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Dual

15 µs

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX1243BCPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

73 MHz

1

CMOS

10

0.0977 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

7.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX153CPP+

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

2

No

2.5 V

1 MHz

1

CMOS

8

0.39 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

875 ns

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX1270BCNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

10 V

110 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

SDIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

11 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX176BEPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0183 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX1247BCPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

4

No

1.25 V

133 kHz

1

CMOS

12

0.0244 %

3.6 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

65 µs

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

5962-9169202QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

40.63 µs

R-GDIP-T28

No

e4

MAX164CENG+

Analog Devices

Analog To Digital Converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.024 %

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

1

e3

30 s

260 °C (500 °F)

MAX1271ACNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

4.096 V

100 kHz

1

12

0.0122 %

5 V

Binary, 2's Complement Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-4.096 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

11 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX192BEPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

10

0.0977 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

2 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX180BCPL+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

5962-9169102QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

100 kHz

1

MIL-PRF-38535 Class Q

12

0.0488 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

8.12 µs

R-GDIP-T28

No

e4

MAX161ACPI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

1

CMOS

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX118EPI+

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5.25 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

865 ns

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX182BEPI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

4

No

5 V

1

CMOS

12

10 mA

1 %

15 V

Binary, Offset Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

140 µs

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX186DCPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MAX122ACNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

333 kHz

1

BICMOS

12

20 mA

0.018 %

5 V

2's Complement Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

2.6 µs

R-PDIP-T24

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.25 in (31.75 mm)

MAX122AMRG/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

500 kHz

1

BICMOS

12

0.018 %

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.6 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9169101QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

100 kHz

1

MIL-PRF-38535 Class Q

12

0.0732 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

8.12 µs

R-GDIP-T28

No

e4

MAX189CCPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

4.096 V

75 kHz

1

CMOS

12

2 mA

0.0488 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

8.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX190BCNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

76 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

18 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX188AMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MAX159BEPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0977 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

7 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MX7572JN05+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

5.2 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX145BMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX180ACPL+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

5962-8967601QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX176ACPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0122 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX170CMJA/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0183 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Dual

5.6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7824TQ/883

Analog Devices

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

MX7824UQ/883

Analog Devices

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

MAX187AEPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

4.096 V

75 kHz

1

CMOS

12

2.5 mA

0.0122 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

8.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX1247ACPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

4

No

1.25 V

133 kHz

1

CMOS

12

0.0122 %

3.6 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

65 µs

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

MAX160MJN/883

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MAX186CMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MAX140EPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

200 mV

1

CMOS

24

0.0015 %

5 V

Binary

5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.07 mm)

5962-8967401QC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.52 V

55.6 kHz

1

CMOS

14

0.0092 %

5 V

Binary, Offset Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

14.25 µs

R-GDIP-T40

No

e4

MAX166CCPP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

2.58 V

200 kHz

1

CMOS

8

6 mA

0.195 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

ICL7129ACJL

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2 V

1

CMOS

4

9 V

Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T40

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX191ACNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5.25 V

Serial, Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

18 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX170CCPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0122 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

5.6 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

MAX191BENG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5.25 V

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

18 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX145AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0122 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX121CPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

308 kHz

1

BICMOS

14

Binary

5,-12/-15 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

2.91 µs

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.