Through-Hole Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD6700703D

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

8

45 mA

0.390625 %

5 V

Offset Binary, 2's Complement Binary

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

13 µs

R-CDIP-T20

AD671JD-750

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0488 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

PMAD7572ALN10

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

0.012 %

Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

AD873JN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

30 MHz

1

CMOS

10

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.485 mm)

AD1878

Analog Devices

Analog To Digital Converter Subsystem

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

BICMOS

16

5 V

2's Complement Binary

-5 V

In-Line

70 °C (158 °F)

-3 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

400 µs

R-PDIP-T28

No

e0

5962-8763501RA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5 V

1

Bipolar

38535Q/M;38534H;883B

8

45 mA

0.4 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

3.4 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

LTC1276BCN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

2.7 ms

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

AD676AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

16

18 mA

0.003 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

1 ms

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

HAS-1409LM

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

125 kHz

1

Hybrid

14

0.009 %

15 V

Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-PDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

ADC72JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

29 kHz

1

16

0.006 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

LTC1272-8CCN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

250 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8 ms

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e0

5962-8865803XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.018 %

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

1.62 in (41.15 mm)

AD677JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

16

12 V

Binary

5,±12 V

-12 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial

0 °C (32 °F)

Sample

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.75 in (19.05 mm)

HAS-0802MB

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Metal

1

No

1

Bipolar

38535Q/M;38534H;883B

8

Offset Binary

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

5962-9684601QLX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

600 kHz

1

CMOS

12

5 V

2's Complement Binary

In-Line

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

1.68 µs

R-GDIP-T24

Yes

PM0820AR

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1098ACN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

6.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e0

AD671JN-750

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

11 V

1.4 MHz

1

CMOS

12

56 mA

0.048 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-6.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

750 ns

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

LTC1291BCN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

5.05 V

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

AD676KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

16

18 mA

0.0023 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

1 ms

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9027BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

31 MHz

1

Bipolar

12

260 mA

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.284 in (7.21 mm)

0.6 in (15.24 mm)

No

e0

1.4 in (35.56 mm)

AD7829BNZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5.5 V

2 MHz

1

CMOS

8

0.293 %

3 V

Binary

3/5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

420 ns

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

AD7572LN12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

13 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

AD574TD

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

12

0.024 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7582KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

4

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

100 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.703 mm)

5962-8776201VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

38535Q/M;38534H;883B

8

7 mA

0.2 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1091ACN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

5.05 V

1

10

0.0488 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

20 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

LTC1296CCN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

46.5 kHz

1

CMOS

12

0.0122 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

12 µs

R-PDIP-T20

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e0

AD574SD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

Bipolar

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

PM0820FR

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-01-252-1496

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.098 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

LTC1605ACN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

6.25 kHz

1

CMOS

16

0.0031 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8 µs

R-PDIP-T28

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

AN1678KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

200 kHz

1

12

12 V

Binary, 2's Complement Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Sample

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

1.445 in (36.7 mm)

AD7714SQ-5

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5

No

2.5 V

1

CMOS

24

0.0015 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

AD9032TD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

25 MHz

1

CMOS

38535Q/M;38534H;883B

12

672 mA

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7884TQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

16

30 mA

0.003 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-7.3 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

5.3 µs

R-GDIP-T40

0.21 in (5.33 mm)

0.6 in (15.24 mm)

No

e0

LTC1272-8CCN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

250 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

8 ms

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

AD7858LANZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

5.5 V

100 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3.3/5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

18 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD7572AAN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7890AN-4

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

4.096 V

117 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

AD7572AJN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7892BN-2

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

500 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

1.6 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

ADC85S-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

10

140 mA

0.048 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e0

1.612 in (40.945 mm)

AD7880CN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

66 kHz

1

BICMOS

12

10 mA

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

12 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.485 mm)

AD7672LN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7858LAN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

5.5 V

100 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3.3/5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

18 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

5962-01-145-3422

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T28

No

AD671JD-500

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0977 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.