Through-Hole Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX162AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

3.25 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1249BCPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

4

No

1.25 V

13.3 kHz

1

CMOS

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

65 µs

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

MAX159AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0488 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574SQ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MAX158BMDI

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

e0

MAX1171CDJ

Analog Devices

Analog To Digital Converter, Flash/Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

20 MHz

1

CMOS

12

150 mA

5 V

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-CDIP-T32

0.21 in (5.33 mm)

0.6 in (15.24 mm)

No

e0

MAX174CCPI+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8 µs

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX131ACPL+

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

16

120 μA

0.0015 %

9 V

Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

200 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

2.05 in (52.075 mm)

5962-9169202QXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

40.63 µs

R-GDIP-T28

No

e0

MAX1240AMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

3.65 V

73 kHz

1

BICMOS

12

0.0122 %

3 V

Binary

3/3.3 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

MAX163CENG+

Analog Devices

Analog To Digital Converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.024 %

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

e3

30 s

260 °C (500 °F)

MAX150BEPP+

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

2 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

5962-8967901QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

63 kHz

1

CMOS

MIL-STD-883

12

0.0122 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

12.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX162CING

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX186AMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MAX164CCNG+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

8.13 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX185BCNG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

10.4 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX183BENG

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX184BMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX185AENG

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.012 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

10.4 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX183BCNG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX184AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.018 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX183AENG

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.012 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX194BCPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

85 kHz

1

14

0.0061 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

MAX185AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.018 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX184BCNG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

5.2 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX184BENG

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

5.2 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX185ACNG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.012 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

10.4 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX183ACNG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.012 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

3.25 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX195BCPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

85 kHz

1

CMOS

16

0.004 %

5 V

Binary, Offset Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

2 µs

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

MAX194BEPE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

85 kHz

1

CMOS

14

5 mA

0.0061 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

MAX185BENG

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

10.4 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX184ACNG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.012 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

5.2 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX184AENG

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

10 mA

0.012 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

5.2 s

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX185BMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

AD7893AN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BIMOS

12

10 mA

0.024 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.5 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

AD7552KN/+

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

1

CMOS

12

Binary

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

e0

AD5202AD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

LTC1289BCN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

3.05 V

25 kHz

1

CMOS

12

0.0122 %

3 V

2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

26 µs

R-PDIP-T20

0.165 in (4.2 mm)

0.3 in (7.62 mm)

No

e3

PM7574FP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

17 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

ADADC80-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

21 µs

R-CDIP-T32

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.2 in (30.48 mm)

AD7878JNZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

8.3 kHz

1

CMOS

12

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Dual

7.125 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

1.445 in (36.705 mm)

AD872SD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

38535Q/M;38534H;883B

12

150 mA

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1283CN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

3.05 V

15 kHz

1

CMOS

10

0.0488 %

3 V

Binary, 2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDIP-T20

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

LTC1290BCN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

50 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

13 µs

R-PDIP-T20

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

AD7710SQ/883B

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

1

CMOS

MIL-STD-883 Class B

24

0.003 %

5 V

Binary, Offset Binary

±5/10 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9050802MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

125 MHz

1

Bipolar

8

0.1953 %

Binary

-5.2 V

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

AD7703AN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

16 kHz

1

CMOS

20

0.003 %

5 V

Binary, Offset Binary

±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDIP-T20

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e0

0.965 in (24.51 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.