Military Digital-to-Analog Converters 1,864

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7224UQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

8

20 µs

6 mA

0.195 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-9091104MXX

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

12

0.0305 %

Parallel, Word

5 V

-5.2 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Palladium/Gold

Dual

R-CDIP-T28

No

e4

Binary

AD7549TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

1.5 µs

5 mA

0.0122 %

Parallel, 4 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.175 in (4.45 mm)

0.3 in (7.62 mm)

No

e0

1.062 in (26.972 mm)

Binary, Offset Binary

DAC100CCQ5/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

Hybrid

MIL-STD-883 Class B

10

0 ns

8.33 mA

0.2 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

375 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.75 in (19.05 mm)

Complementary Binary

5962-87702042B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 mA

Parallel, Word

5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

Binary

AD7543SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2.5 mA

0.024 %

Serial

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD7543SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

12

2 µs

0.024 %

Serial

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

350 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

5962-9689202VJX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T24

Yes

Binary, Offset Binary

AD7237ATQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

2

CMOS

MIL-STD-883 Class B

12

12 µs

15 mA

0.012 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

AD7522TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.1 %

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

Binary

AD7541TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

1 µs

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

No

e0

Binary, Offset Binary

AD7543GTQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

2 µs

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

350 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

5962-9689201VJA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

MIL-PRF-38535 Class V

12

18 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.715 mm)

0.606 in (15.4 mm)

Yes

e0

1.29 in (32.76 mm)

Binary, Offset Binary

5962-01-375-2535

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

8

3 µs

25 mA

0.15 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary

AD7536SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

MOS

14

2 µs

4 mA

0.012 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

Offset Binary

DAC331B-12-1

Analog Devices

Digital to Analog converter

Military

Pin/Peg

18

DIP

Rectangular

Metal

No

1

Bipolar

38535Q/M;38534H;883B

12

3 µs

1 mA

0.012 %

Parallel, Word

5 V

5 V

In-Line

DIP18,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P18

0.234 in (5.9436 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

5962-87763023C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

12

2 mA

Parallel, 8 Bits

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e4

0.45 in (11.43 mm)

Binary, Offset Binary

5962-89481032X

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

10 V

Yes

1

CMOS

MIL-STD-883

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

Binary

DAC8408BT

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

4

CMOS

8

0 ns

1.5 mA

0.1953 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP28,.6

Other Converters

190 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD7245ATE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

CMOS

MIL-STD-883 Class B

12

10 µs

12 mA

0.0183 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

AD7549SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

5 mA

0.0244 %

Parallel, 4 Bits

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

AD566ATD

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

0 ns

18 mA

0.0122 %

Parallel, Word

15 V

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-1.5 V

Binary, Offset Binary

DAC-8413BT/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

9.9853 V

No

4

BICMOS

12

13 mA

0.0366 %

Parallel, Word

15 V

-15 V

In-Line

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-9.9902 V

Binary

AD7542TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.0122 %

Parallel, Word

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

5962-8776303LA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

BICMOS

38535Q/M;38534H;883B

12

1.5 µs

2 mA

0.012 %

Parallel, 8 Bits

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7224UQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

MIL-STD-883 Class B

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7534TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

MOS

14

1.5 µs

3 mA

0.006 %

Parallel, 8 Bits

12/15,GND/-0.3 V

-.3 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7840SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

3 V

No

1

BICMOS

MIL-STD-883 Class B

14

4 µs

15 mA

0.0122 %

Serial, Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-3 V

Binary

AD7545SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

2 µs

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Binary

5962-01-130-2429

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

M38510/11302BEX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

8

0.1 %

Parallel, 8 Bits

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.75 in (19.05 mm)

Binary

AD7525UD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

0.025 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary Coded Decimal

5962-8866301LA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

8

CMOS

8

22 mA

Parallel, 8 Bits

15 V

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962L8993203VFA

Analog Devices

Digital to Analog converter

Military

Flat

16

DFP

Rectangular

50k Rad(Si)

Ceramic, Glass-Sealed

18 V

Yes

1

MIL-PRF-38535 Class V

8

15 V

-15 V

Flatpack

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDFP-F16

Yes

-10 V

Binary

AD561TCHIPS

Analog Devices

Digital to Analog converter

Military

No Lead

16

DIE

Yes

1

Bipolar

10

16 mA

0.05 %

Parallel, Word

5 V

5,-15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

250 ns

125 °C (257 °F)

-55 °C (-67 °F)

Upper

X-XUUC-N16

No

Binary

5962-87789012A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

Bipolar

38535Q/M;38534H;883B

8

5 µs

25 mA

0.29 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

e0

0 V

0.35 in (8.89 mm)

Binary

AD7225TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

MIL-STD-883 Class B

8

7 µs

12 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-8965703LA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-87763013A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

12

2 mA

Parallel, 8 Bits

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary, Offset Binary

DAC8408AT

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

4

CMOS

8

0 ns

1.5 mA

0.0977 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP28,.6

Other Converters

190 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

M38510/12103BJC

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

MIL-PRF-38535 Class B

12

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

No

e0

Binary

AD7527TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD5668SRU-EP-1RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

2.6 mA

0.032 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0 V

0.197 in (5 mm)

Binary

PM7545AR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, 2's Complement Binary

AD7525TD/+

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

1 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

e0

Binary Coded Decimal

AD7521UQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.05 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

5962-8770003EA

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

8

500 ns

2 mA

1.9531 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

100 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

0.75 in (19.05 mm)

Binary

AD7111TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

8

4 mA

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.