No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2637CDE-HZ8#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

8

0.1953 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7248AE

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

CMOS

12

10 µs

12 mA

0.024 %

Parallel, Word

12 V

12/15,GND/-12/-15 V

-12 V

Chip Carrier

DIP20,.3

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

-5 V

0.35 in (8.89 mm)

Binary

LTC2636CDE-HZ10#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

PM7226ARCMDX

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

4

BICMOS

38535Q/M;38534H;883B

8

12/15, GND/-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary

LTC2289CUP#TR

Analog Devices

Digital to Analog converter

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1.9 V

Yes

2

CMOS

10

0.0586 %

Parallel, Word

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5.9 ns

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

1 V

0.354 in (9 mm)

Offset Binary, 2's Complement Binary

LTC2634CUD-LMI12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

5962-89697013X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

4 V

Yes

1

BICMOS

16

Parallel, Word

15 V

-15 V

Chip Carrier

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

-3 V

0.45 in (11.43 mm)

Binary

AD7840SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

14

4 µs

15 mA

0.0122 %

Serial, Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

2 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

5962-87763033B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

12

2 mA

Parallel, 8 Bits

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary, Offset Binary

LTC2672CUH-16#PBF

Analog Devices

Digital to Analog Converter 16 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

16

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

200 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

LTC2606CDD#TR

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

5962-9176402M3A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

9.9853 V

Yes

4

BICMOS

MIL-STD-883

12

15 µs

13 mA

0.0366 %

Parallel, Word

15 V

5/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e0

-9.9902 V

0.45 in (11.43 mm)

Binary

LTC2636HDE-LZ12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD9740ACP-PCB

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

1.25 V

Yes

1

CMOS

10

0.0684 %

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

-1 V

0.197 in (5 mm)

Binary, 2's Complement Binary

AD5665BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5445BCP

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

VQCCN

Square

Yes

1

CMOS

12

10 μA

0.0488 %

Parallel, Word

3/5 V

Chip Carrier, Very Thin Profile

LCC20,.16SQ,20

Other Converters

40 ns

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N20

0.035 in (0.9 mm)

0.157 in (4 mm)

No

e0

0.157 in (4 mm)

Binary

AD7808BCHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

DIE

Yes

8

CMOS

10

Serial

3.3 V

Uncased Chip

4 µs

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N

No

Binary, Offset Binary, 2's Complement Binary

DAC312G

Analog Devices

Digital to Analog converter

No Lead

16

DIE

10 V

Yes

1

12

0.05 %

Parallel, Word

15 V

-15 V

Uncased Chip

250 ns

Tin Lead

Upper

X-XUUC-N16

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

PM7628G

Analog Devices

Digital to Analog converter

No Lead

20

DIE

Rectangular

15.75 V

Yes

1

CMOS

8

0 ns

0.195 %

Parallel, 8 Bits

5 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N20

No

e0

0 V

Binary, Offset Binary

LTC2642IDD-14#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0061 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

AD5348BCP

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

VQCCN

Square

5.499 V

Yes

1

CMOS

12

10 µs

1.8 mA

0.3906 %

Parallel, Word

3 V

3/5 V

Chip Carrier, Very Thin Profile

LCC40,.24SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e0

240 °C (464 °F)

.001 V

0.236 in (6 mm)

Binary

AD7547TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

MIL-STD-883 Class B

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD5541ABCPZ-1

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

Yes

1

CMOS

16

150 μA

0.0015 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.12,25

Other Converters

1 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

No

0.118 in (3 mm)

Binary

LTC2616IDD

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

AD9712BSE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

38535Q/M;38534H;883B

12

183 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

LTC2635CUD-LMO8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

PM7224BRC/883

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

12.5 V

Yes

1

CMOS

38535Q/M;38534H;883B

8

5 µs

6 mA

0.391 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary

AD9139BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

16

26.6 mA

Serial

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

PM7545BRC/883

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, 2's Complement Binary

PM7524BRC/883

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

MOS

38535Q/M;38534H;883B

8

0 ns

1 mA

0.1 %

Parallel, 8 Bits

15 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2626IDD#TR

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

AD9114BCPZRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

3.25 V

Yes

1

8

0.0117 %

Serial, Parallel, 8 Bits

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

11.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.236 in (6 mm)

Binary, 2's Complement Binary

AD7543TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

Serial

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e4

0.35 in (8.89 mm)

Binary

AD5424YCP-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

CMOS

8

60 ns

5 μA

0.0977 %

Parallel, 8 Bits

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

Other Converters

30 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N20

3

0.039 in (1 mm)

0.157 in (4 mm)

No

e0

240 °C (464 °F)

.4 V

0.157 in (4 mm)

Binary

DAC02G

Analog Devices

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

11.5 V

Yes

1

Bipolar

10

0.2 %

Parallel, Word

15 V

-15 V

Uncased Chip

2 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary

5962-89481022C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 mA

Parallel, Word

Chip Carrier

600 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD667SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

MIL-STD-883 Class B

12

4 µs

0.0183 %

Parallel, Word

12 V

-12 V

Chip Carrier

LCC28,.45SQ

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.09 in (2.29 mm)

0.45 in (11.43 mm)

No

e0

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary, 2's Complement Binary

LTC2634CUD-HZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

8

0.1953 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8222GBC

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

15 V

Yes

1

CMOS

MIL-STD-883 Class B (Modified)

12

1 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Uncased Chip

DIE OR CHIP

Other Converters

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

X-XUUC-N24

No

e0

0 V

Binary, Offset Binary

LTC2636IDE-HZ12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2617IDE-1#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2634HUD-LMI12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7111TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

1

CMOS

8

4 mA

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Complementary Binary

LTC2637CDE-HZ10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

DAC8248GBC

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

Rectangular

Yes

2

CMOS

MIL-STD-883 Class B (Modified)

12

1 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Uncased Chip

DIE OR CHIP

Other Converters

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N24

No

e0

Binary, Offset Binary

LTC2635HUD-HMI10#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7542TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

250 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2634HUD-LMX10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.