No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

5962-87700032A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

8

500 ns

2 mA

1.9531 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

100 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

e4

0.35 in (8.89 mm)

Binary

AD7542GTE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

250 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2621CDD#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7542TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

250 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

AD7545AUE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, 2's Complement Binary

LTC2617IDE#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7547BE

Analog Devices

Digital to Analog converter

Industrial

No Lead

28

QCCN

Square

Ceramic

Yes

2

BICMOS

12

1.5 µs

2 mA

0.012 %

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Binary

LTC2636CDE-HZ12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.8 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

ADV7125BCPZ170-RL

Analog Devices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1.4 V

Yes

1

CMOS

8

0.3906 %

Parallel, 8 Bits

3.3 V

3.3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.276 in (7 mm)

Binary

AD5675RACPZ-RL

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

16

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-89481012B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 mA

Parallel, Word

Chip Carrier

600 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

Binary

LTC2753ACUK-16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

LTC2606CDD-1

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2637CDE-HZ10#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7536SE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

MOS

14

2 µs

4 mA

0.012 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Offset Binary

LTC2657CUFD-H12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2755IUP-12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

AD5392BCP-5

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

CMOS

14

10 µs

0.0183 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

DAC10CHIPS

Analog Devices

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

5.5 V

Yes

1

10

Parallel, Word

15 V

-15 V

Uncased Chip

85 ns

70 °C (158 °F)

0 °C (32 °F)

Upper

R-XUUC-N18

No

-5.5 V

Binary, Offset Binary

LTC2654IUF-L12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2634IUD-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7226TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

MIL-STD-883 Class B

8

20 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

LTC2635CUD-LMX8#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2626CDD#TR

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2636IDE-LZ8#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2607CDE

Analog Devices

Digital to Analog converter

Commercial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

16

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.157 in (4 mm)

Binary

LTC2626IDD-1

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

AD5668BCPZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2664HUH-12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

0.0244 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

15.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

LTC2635HUD-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2642CDD-14#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0061 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

AD5673RBCPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.02441 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD9743BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

10

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

LTC2636CDE-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.8 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5390BCP-3

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Serial

3 V

3.3,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD561-000C

Analog Devices

Digital to Analog converter

Military

No Lead

16

DIE

Rectangular

Yes

1

MIL-PRF-38534 Class K

10

Parallel, Word

5 V

-15 V

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

R-XUUC-N16

0.106 in (2.69 mm)

0.153 in (3.88 mm)

Binary

DAR01G

Analog Devices

Digital to Analog converter

No Lead

5

DIE

Rectangular

Yes

1

10

0.5 %

Parallel, Word

15 V

-15 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N5

No

e0

Complementary Binary

LTC2672IUH-16#PBF

Analog Devices

Digital to Analog Converter 16 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

16

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

200 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

DAC8412BTC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

MIL-STD-883

12

12 mA

0.0366 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

AD5623RBCPZ-3

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

3.6 V

Yes

1

CMOS

12

10 µs

0.0244 %

Serial

3 V

3.3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

LTC2634CUD-LMX10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7111ABCHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

DIE

Yes

1

BICMOS

8

Parallel, 8 Bits

5 V

Uncased Chip

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N

No

Binary

LTC2655CUF-L12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

4

CMOS

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2635CUD-HZ10#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD9707BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

1.25 V

Yes

1

CMOS

14

6.7 mA

0.0366 %

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.197 in (5 mm)

Binary, 2's Complement Binary

AD9152BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

Plastic/Epoxy

.347 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

e3

.23 V

0.315 in (8 mm)

Binary, 2's Complement Binary

LTC2654CUF-L12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2634HUD-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.