No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2751IUHF-12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

DAC-888N

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

5 V

Yes

1

8

16 mA

0.1 %

Parallel, 8 Bits

5 V

-12 V

Uncased Chip

300 ns

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-5 V

Binary

LTC2634CUD-LMI10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5675BCPZ-RL

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5.5 V

Yes

1

16

0.0046 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD9117BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

3.25 V

Yes

1

14

0.0073 %

Serial, Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

11.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.236 in (6 mm)

Binary, 2's Complement Binary

LTC2636HDE-LMI12#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2634IUD-LMI10#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2637HDE-LZ12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5392BCP-3-REEL

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Serial

3 V

3.3,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD7111BCHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

DIE

Yes

1

BICMOS

8

Parallel, 8 Bits

5 V

Uncased Chip

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N16

No

Binary

5962-89808023A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

12

32 mA

Parallel, Word

15 V

-15 V

Chip Carrier

50 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD5667RBCPZ-250RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

VSON

Square

5.5 V

Yes

1

CMOS

16

0.0183 %

Serial

5 V

Small Outline, Very Thin Profile

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

LTC2635CUD-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5620BCPZ-2500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

LTC2755IUP-14#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

14

0.0061 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

LTC2635CUD-LMO10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7542GTE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

250 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

DAC8222G

Analog Devices

Digital to Analog converter

No Lead

24

DIE

Rectangular

15 V

Yes

1

CMOS

12

1 µs

0.0244 %

Parallel, Word

5 V

Uncased Chip

Tin Lead

Upper

R-XUUC-N24

No

e0

0 V

Binary, Offset Binary

LTC2611CDD-1#TR

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2654IUF-H12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.6 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2617IDE#TR

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

14

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.157 in (4 mm)

Binary

AD9780BCPZRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

12

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N72

0.039 in (1 mm)

0.394 in (10 mm)

No

-1 V

0.394 in (10 mm)

Binary

5962-87701022A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

180 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

e4

0.35 in (8.89 mm)

Binary, Offset Binary

5962-9176404M3A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

9.9853 V

Yes

4

BICMOS

MIL-STD-883

12

15 µs

13 mA

0.0366 %

Parallel, Word

15 V

5/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e0

-9.9902 V

0.45 in (11.43 mm)

Binary

AD5413BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

12.6 V

Yes

1

14

20 µs

0.012 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

12 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

-12.6 V

0.197 in (5 mm)

Binary

LTC7106IDDB-1#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Rectangular

Plastic/Epoxy

Yes

1

CMOS

7

1.25 %

Serial

3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N10

0.031 in (0.8 mm)

0.079 in (2 mm)

e3

0.118 in (3 mm)

2's Complement

AD7845SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

CMOS

MIL-STD-883 Class B

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.09 in (2.29 mm)

0.45 in (11.43 mm)

No

e0

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary

AD9135BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

11

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD569SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

BIMOS

MIL-STD-883 Class B

16

6 µs

26 mA

0.04 %

Parallel, Word

12 V

±12 V

-12 V

Chip Carrier

LCC28,.45SQ

Other Converters

4 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

LTC2635HUD-HMO10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

LTC2635CUD-LMO10#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5624BCPZ-250RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

DAC312GBC

Analog Devices

Digital to Analog converter

Other

No Lead

20

DIE

Rectangular

10 V

Yes

1

Bipolar

MIL-STD-883 Class B (Modified)

12

18 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

250 ns

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

LTC2636HDE-LMX10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5669RACPZ-3

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

10 µs

2.5 mA

0.0488 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N16

0.031 in (0.8 mm)

0.157 in (4 mm)

No

0 V

0.157 in (4 mm)

Binary

AD5542ABCPZ-1

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

Yes

1

16

0.0015 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

1 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

No

0.118 in (3 mm)

Binary

LTC2636IDE-HMX8#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

8

0.1953 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5391BCP-3-REEL

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

3.6 V

Yes

1

CMOS

12

8 µs

0.0244 %

Serial

3 V

3.3,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

6 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD7846SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

BICMOS

38535Q/M;38534H;883B

16

9 µs

5 mA

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-10 V

0.45 in (11.43 mm)

Binary

AD9740ACPRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

1.25 V

Yes

1

CMOS

10

0.0684 %

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

-1 V

0.197 in (5 mm)

Binary, 2's Complement Binary

LTC2610CUFD#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

4 mA

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16X.2,20

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

5962-01-309-5959

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

BICMOS

38535Q/M;38534H;883B

16

6 µs

26 mA

0.04 %

12 V

±12 V

-12 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

Binary, Offset Binary

LTC2641CDD-14#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

8

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0061 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

AD7945BCHIPS

Analog Devices

Digital to Analog converter

No Lead

DIE

Yes

1

12

0.0122 %

Parallel, Word

5 V

Uncased Chip

600 ns

Upper

X-XUUC-N

No

Binary, Offset Binary

LTC2634HUD-HMX10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2655CUF-H12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

4

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2656CUFD-L12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2655BCUF-L16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

4

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.