4 PIN Diodes 107

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Part RoHS Manufacturer Diode Type Terminal Position Terminal Form No. of Terminals Surface Mount Package Shape Package Body Material Diode Resistive Test Current Config Frequency Band Maximum Forward Voltage (VF) Maximum Diode Capacitance Technology Maximum Reverse Current No. of Elements Reverse Test Voltage Package Style (Meter) Sub-Category Maximum Repetitive Peak Reverse Voltage Maximum Operating Temperature Application Minimum Operating Temperature Terminal Finish JESD-30 Code Maximum Diode Forward Resistance Moisture Sensitivity Level (MSL) Case Connection Qualification Maximum Power Dissipation Nominal Diode Capacitance Additional Features Nominal Minority Carrier Lifetime JEDEC-95 Code Minimum Breakdown Voltage Maximum Non Repetitive Peak Forward Current JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Diode Element Material Diode Resistive Test Frequency Reference Standard

BAR65-07

Infineon Technologies

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

5 mA

SEPARATE, 2 ELEMENTS

.9 pF

POSITIVE-INTRINSIC-NEGATIVE

2

1 V

SMALL OUTLINE

PIN Diodes

125 Cel

SWITCHING

TIN LEAD

R-PDSO-G4

.9 ohm

CATHODE

Not Qualified

.25 W

.6 pF

.08 us

30 V

e0

SILICON

BAR64-07E6433

Infineon Technologies

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

1 mA

SEPARATE, 2 ELEMENTS

S BAND

.35 pF

POSITIVE-INTRINSIC-NEGATIVE

2

0 V

SMALL OUTLINE

PIN Diodes

125 Cel

ATTENUATOR; SWITCHING

Matte Tin (Sn)

R-PDSO-G4

20 ohm

CATHODE

Not Qualified

.25 W

.17 pF

HIGH VOLTAGE

1.55 us

200 V

e3

SILICON

100 MHz

BAR65-07F

Infineon Technologies

PIN DIODE

DUAL

FLAT

4

YES

RECTANGULAR

PLASTIC/EPOXY

SEPARATE, 2 ELEMENTS

.9 pF

POSITIVE-INTRINSIC-NEGATIVE

2

SMALL OUTLINE

SWITCHING

R-PDSO-F4

.9 ohm

1

Not Qualified

.25 W

.08 us

30 V

SILICON

JDP4P02AT

Toshiba

PIN DIODE

DUAL

FLAT

4

YES

RECTANGULAR

PLASTIC/EPOXY

10 mA

SINGLE

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

.4 pF

POSITIVE-INTRINSIC-NEGATIVE

1

1 V

SMALL OUTLINE

PIN Diodes

150 Cel

SWITCHING

TIN LEAD

R-PDSO-F4

1.5 ohm

Not Qualified

.3 pF

30 V

e0

SILICON

100 MHz

JDP4L08CTC

Toshiba

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

10 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.4 pF

POSITIVE-INTRINSIC-NEGATIVE

2

1 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

R-XBCC-N4

1.5 ohm

Not Qualified

.21 pF

30 V

SILICON

100 MHz

1SV312

Toshiba

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

1 V

POSITIVE-INTRINSIC-NEGATIVE

.1 uA

50 V

SMALL OUTLINE

Other Diodes

50 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

R-PDSO-G4

Not Qualified

e0

SILICON

JDP4P02U

Toshiba

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

SEPARATE, 2 ELEMENTS

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

.5 pF

POSITIVE-INTRINSIC-NEGATIVE

2

1 V

SMALL OUTLINE

PIN Diodes

125 Cel

ATTENUATOR

TIN LEAD

R-PDSO-G4

Not Qualified

.3 pF

30 V

e0

SILICON

JDP4P08CTC

Toshiba

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

10 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.4 pF

POSITIVE-INTRINSIC-NEGATIVE

2

1 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

R-XBCC-N4

1.5 ohm

Not Qualified

.21 pF

30 V

SILICON

100 MHz

1SV237TE85R

Toshiba

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

SEPARATE, 2 ELEMENTS

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

SMALL OUTLINE

125 Cel

ATTENUATOR

R-PDSO-G4

Not Qualified

50 V

SILICON

1SV237

Toshiba

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

SEPARATE, 2 ELEMENTS

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

SMALL OUTLINE

Varactors

50 V

125 Cel

ATTENUATOR

Tin/Lead (Sn/Pb)

R-PDSO-G4

CATHODE

Not Qualified

.25 pF

50 V

e0

SILICON

1SV237TE85L

Toshiba

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

SEPARATE, 2 ELEMENTS

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

SMALL OUTLINE

Varactors

50 V

125 Cel

ATTENUATOR

R-PDSO-G4

Not Qualified

.25 pF

50 V

SILICON

1SV237(TE85L,F)

Toshiba

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

SEPARATE, 2 ELEMENTS

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

SMALL OUTLINE

125 Cel

ATTENUATOR

R-PDSO-G4

CATHODE

.25 pF

50 V

SILICON

HVB187YP

Renesas Electronics

PIN DIODE

DUAL

GULL WING

4

YES

RECTANGULAR

PLASTIC/EPOXY

10 mA

SEPARATE, 2 ELEMENTS

VERY HIGH FREQUENCY

1 V

2.4 pF

POSITIVE-INTRINSIC-NEGATIVE

.1 uA

2

60 V

SMALL OUTLINE

Other Diodes

60 V

125 Cel

ATTENUATOR

R-PDSO-G4

5.5 ohm

Not Qualified

.1 W

60 V

SILICON

100 MHz

HMPP-3864-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

SEPARATE, 2 ELEMENTS

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-CBCC-N4

1

Not Qualified

.5 us

50 V

e3

SILICON

HMPP-389T-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3895-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3864-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

SEPARATE, 2 ELEMENTS

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-CBCC-N4

1

Not Qualified

.5 us

50 V

e3

SILICON

HMPP-3893-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SEPARATE, 2 ELEMENTS

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

SWITCHING

TIN

R-XBCC-N4

2.5 ohm

1

Not Qualified

.2 us

100 V

e3

SILICON

HMPP-3865

Broadcom

PIN DIODE

UPPER

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

1 mA

SEPARATE, 2 ELEMENTS

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

UNCASED CHIP

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-XUUC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3863-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

SEPARATE, 2 ELEMENTS

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-CBCC-N4

1

Not Qualified

.5 us

50 V

e3

SILICON

HMPP-3860-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

1

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3864-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

SEPARATE, 2 ELEMENTS

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-CBCC-N4

1

Not Qualified

.5 us

50 V

e3

SILICON

HMPP-389T

Broadcom

PIN DIODE

UPPER

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

POSITIVE-INTRINSIC-NEGATIVE

UNCASED CHIP

150 Cel

Tin (Sn)

R-XUUC-N4

1

Not Qualified

e3

20

260

SILICON

HMPP-3895

Broadcom

PIN DIODE

UPPER

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SEPARATE, 2 ELEMENTS

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

UNCASED CHIP

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-XUUC-N4

3.8 ohm

1

Not Qualified

.2 us

50 V

e3

20

260

SILICON

HMPP-3893-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SEPARATE, 2 ELEMENTS

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

SWITCHING

TIN

R-XBCC-N4

2.5 ohm

1

Not Qualified

.2 us

100 V

e3

SILICON

HMPP-3894-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SEPARATE, 2 ELEMENTS

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

SWITCHING

TIN

R-XBCC-N4

2.5 ohm

1

Not Qualified

.2 us

100 V

e3

SILICON

HMPP-3894-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SEPARATE, 2 ELEMENTS

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

SWITCHING

TIN

R-XBCC-N4

2.5 ohm

1

Not Qualified

.2 us

100 V

e3

SILICON

HMPP-3892-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3890-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-389T-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3893-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SEPARATE, 2 ELEMENTS

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

SWITCHING

TIN

R-XBCC-N4

2.5 ohm

1

Not Qualified

.2 us

100 V

e3

SILICON

HMPP-3890-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3860-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

1

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3862-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3890-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3860

Broadcom

PIN DIODE

UPPER

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

1 mA

SINGLE

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

UNCASED CHIP

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-XUUC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3863-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

SEPARATE, 2 ELEMENTS

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-CBCC-N4

1

Not Qualified

.5 us

50 V

e3

SILICON

HMPP-3862-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3865-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-389T-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3865-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3860-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SINGLE

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

1

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3890

Broadcom

PIN DIODE

UPPER

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SINGLE

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

UNCASED CHIP

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-XUUC-N4

3.8 ohm

1

Not Qualified

.2 us

50 V

e3

20

260

SILICON

HMPP-3892-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

HMPP-3894-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

UNSPECIFIED

SEPARATE, 2 ELEMENTS

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

SWITCHING

TIN

R-XBCC-N4

2.5 ohm

1

Not Qualified

.2 us

100 V

e3

SILICON

HMPP-3863-TR2

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

SEPARATE, 2 ELEMENTS

POSITIVE-INTRINSIC-NEGATIVE

2

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-CBCC-N4

1

Not Qualified

.5 us

50 V

e3

SILICON

HMPP-3862-TR1

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

2

50 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

Tin (Sn)

R-CBCC-N4

22 ohm

1

Not Qualified

.2 pF

.5 us

50 V

e3

20

260

SILICON

100 MHz

HMPP-3895-BLK

Broadcom

PIN DIODE

BOTTOM

NO LEAD

4

YES

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

1 mA

SEPARATE, 2 ELEMENTS

ULTRA HIGH FREQUENCY

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

2

5 V

CHIP CARRIER

PIN Diodes

150 Cel

SWITCHING

Tin (Sn)

R-CBCC-N4

2.5 ohm

1

Not Qualified

.2 pF

.2 us

100 V

e3

20

260

SILICON

100 MHz

PIN Diodes

PIN diodes are electronic components that are used in microwave and radio frequency applications as switches or attenuators. They are named after their structure, which consists of a P-type layer, an intrinsic layer, and an N-type layer.

PIN diodes operate based on the properties of their intrinsic layer, which has a low doping density, making it highly resistive. When a forward-bias voltage is applied to the diode, the intrinsic layer becomes less resistive, allowing current to flow through the diode. When a reverse-bias voltage is applied to the diode, the intrinsic layer becomes highly resistive, acting as an open switch or attenuator for microwave and radio frequency signals.

PIN diodes offer several advantages over other types of switches and attenuators, such as low insertion loss, high isolation, and fast switching speed. They can be used in various applications, such as radio frequency amplifiers, attenuators, switches, and phase shifters.

PIN diodes come in different package sizes and configurations, depending on the application and the required performance. They can be integrated into a circuit board or mounted in a separate enclosure, depending on the application and the space available.